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JSAP 2108, September 18-21, 2018, Nagoya Japan

From LatticeGearSep 3 2018

Visit LatticeGear at Hisol

Demo our scribeless, cleanroom compatible LatticeAx® cleaving system and FlipScribe® ,the only, backside scriber.

DO NOT MISS, LatticeGear Luncheon Seminar: The scribeless cleaving method for glass, sapphire, III-V, SiC and silicon will be presented. In addition, learn about the FlipScribe, surface touchless scribing tool to protect frontside features, ideal for compound substrates and off-crystalline cleaving. Cleanroom compatible.

Online Reservation Deadline : Noon on September 10 (Mon.), 2018 –REGISTER HERE

Contact Information:

LatticeGear LLC
[email protected]

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LatticeGear. (2018, September 03). JSAP 2108, September 18-21, 2018, Nagoya Japan. AZoNano. Retrieved on June 06, 2023 from https://www.azonano.com/news.aspx?newsID=36327.
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LatticeGear. "JSAP 2108, September 18-21, 2018, Nagoya Japan". AZoNano. 06 June 2023. <https://www.azonano.com/news.aspx?newsID=36327>.
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LatticeGear. 2018. JSAP 2108, September 18-21, 2018, Nagoya Japan. AZoNano, viewed 06 June 2023, https://www.azonano.com/news.aspx?newsID=36327.