Ultratech, Inc., a
leading supplier of lithography and laser-processing systems used to manufacture
semiconductor devices, today announced that it has acquired the rights to a
collection of patents from IBM -- these include fundamental patents around the
area of rapid thermal annealing. Representing both U.S. and foreign patents,
the portfolio includes hardware for thermal processing (annealing) of semiconductor
wafers, as well as patents for temperature control and metrology. This acquisition
strengthens and broadens Ultratech's annealing technology capability for ultra-shallow
junction (USJ) formation -- a critical step in semiconductor manufacturing.
"Ultratech has periodically purchased patents that it views are key to
our business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo.
"The acquisition of these patents from IBM is the continuation of that
strategy to ensure that our customers receive the highest technology content
in their products. This acquisition reinforces our commitment to remain at the
forefront of providing equipment with leading-edge technology and low cost-of-ownership
advantages for our global customer base."