EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Sweden-based Silex Microsystems, the world's largest independent MEMS foundry, has placed a major follow-on order for its GEMINI automated bond cluster, EVG 6200NT mask and bond aligner and EVG301 mask cleaner-all of which will be used in the production of highly sophisticated MEMS devices for applications spanning the biotech/medical, telecom, automotive and consumer electronics industries, among others. EVG reports that installation is slated for spring 2009 at Silex's new 8-inch MEMS facility-the first of its kind in Europe-located in Järfälla, Sweden.
"Our company is dedicated to bringing advanced process technologies and manufacturing excellence to our nearly 80 customers worldwide," said Jan Nerdal, Silex CEO. "As a pure-play MEMS manufacturer, we expect only the best from our suppliers when it comes to delivering cost-effective, yet, superior process capabilities, quality and support. EVG has been a valued supplier to Silex since we commenced operations in 2000-consistently delivering over this time, the wafer bonding and aligner solutions we've needed to manufacture our myriad best-in-class MEMS devices. Our recent order with EVG demonstrates the confidence we have in them toward helping us effectively transition from semi-automatic wafer bonding to fully automated production at our prized 8-inch MEMS fab-seamlessly and efficiently."
Commenting on the order, Paul Lindner, EVG's executive technology director, noted, "EVG prides itself on our ongoing commitment to working closely with our customers to ensure their manufacturing processes, and ultimately, fab operations, are running at benchmark levels. For close to three decades now, we've been delivering the best-of-breed equipment and process expertise to today's MEMS value chain-all at a low cost of ownership (CoO). Our longstanding relationship with Silex and recent follow-on order win speaks volumes to the satisfaction shared among today's MEMS community in our ability meet today's exacting MEMS manufacturing requirements."
EVG's GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D integration and advanced packaging, as well as compound semiconductor applications. With more than 100 automated wafer bonder installations worldwide, the GEMINI is designed for the lowest total COO and quickest return on investment. The tool incorporates EVG's patented SmartView bond aligner, which delivers high-precision aligned direct bonding. The GEMINI also features integrated pre-process modules, such as the EVG301 wafer cleaner. Moreover, the system can provide low-temperature plasma activation (silicon direct bonding), and is expandable through four bond chambers to achieve even higher throughputs. The recent order from Silex also includes EVG's 6200NT Aligner, which is the newest generation of the company's more versatile precision alignment tools.