Solar thermal panels developed at EPFL are are dressed up in unique and patented new materials. Researchers created a stronger black coating that retains its original color and thereby its absorption properties much longer than traditional panels.
China's largest and most advanced semiconductor foundry – Semiconductor Manufacturing International Corporation, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.
A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices.
Xilinx, Inc. today announced the first customer shipment of the Virtex® UltraScale™ VU095 All Programmable FPGA, and the expansion of the industry's only 20nm high-end family to enable single chip implementation of 400G and 500G applications.
Applied Materials, Inc. today announced its Applied Endura® Volta(TM) CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.
Although it may not be herding cats exactly, all the NASA-supported Binary Colloidal Alloy Tests (BCAT) studies have ended on the International Space Station, and the experimental samples are being rounded up and returned to the participating scientists. The BCAT series of investigations aims to understand fluids and the physics behind their movement. This research might help in designing new stable products for consumers.
When most people think of silk, the idea of a shimmering, silk scarf, or luxurious gown comes to mind.
In her PhD thesis, Silvia Larumbe-Abuin has developed nanostructures that assist in the process to decontaminate water. The nanostructures (particles of a microscopic size of between 1 and 100 nanometres) are coated in titanium oxide to which nitrogen has been added. This allows sunlight, rather than ultraviolet radiation, to trigger the process involving the chemical reaction and destruction of contaminants.
University of California, Berkeley researchers sponsored by Semiconductor Research Corporation (SRC), the world’s leading university-research consortium for semiconductors and related technologies, are pursuing a novel approach to 3D device integration that promises to lead to advanced mobile devices and wearable electronics featuring increased functionality in more low-profile packages.
While flexible gadgets such as "electronic skin" and roll-up touch screens are moving ever closer to reality, their would-be power sources are either too wimpy or too stiff. But that's changing fast. Scientists have developed a new device that's far thinner than paper, can flex and bend, and store enough energy to provide critical back-up power for portable electronics. Their report appears in the Journal of the American Chemical Society.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.