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SUSS MicroTec Wafer Bonders Continue to Capture Major Market Share in Advanced MEMS Manufacturing

MST.factory dortmund, a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of innova...

From SUSS MicroTec AG 10 Feb 2009

CombiMatrix to Present Preliminary Data On Non-Invasive Cancer Screening Test

CombiMatrix Corporation (Nasdaq:CBMX) announced today that preliminary data on its investigational Comprehensive Cancer Array test will be presented publicly for the first time, at Cambridge Healthtech Institute's 16th International Molecular Medicine Tri-Conference being held on February 25-27, 2009, in San Francisco.

From Invitae Corporation 10 Feb 2009

AIXTRON Receives Order for CRIUS System from New Customer

AIXTRON AG today announced an order received in the second quarter 2008 for an Close Coupled Showerhead CRIUS system with 31x2" wafer configuration from a new customer, Yangzhou Zhongke Semiconductor Lighting Center...

From AIXTRON SE 10 Feb 2009

Luminescent Advances Computational Lithography Lead

Luminescent Technologies, Inc., the pioneer and first-to-market provider of computational lithography solutions for the global semiconductor industry, continues to advance its lead, with six major semiconductor manufacturers in Europe, Japan, Korea, Taiwan, and the US now using its Inverse Lithography Technology (ILT) to develop computational solutions in a mix of environments -- from production at the 50- nm node to development at 36-nm, 28-nm and 22-nm nodes.

9 Feb 2009

State of the Art in Medical Applications of Nanotechnology

On March 4 - 6, 2009, international experts will gather in Berlin for the NanoMed 2009 conference to discuss the state of the art in medical applications of nanotechnology. Medical and healthcare applications are the ...

9 Feb 2009

SiliconBlue Technologies Announces Volume Shipments for 65nm SRAM-Based FPGAs

SiliconBlue Technologies today announced volume production shipments for its 65nm, SRAM-based FPGAs for handheld, ultra-low power applications. These include the iCE65L02, iCE65L04 and iCE65L08 devices with the balance of the family to follow in a few months.

9 Feb 2009