Veeco Instruments Inc. today announced that it has acquired privately held Solid State Equipment Holdings LLC, based in Horsham, Pennsylvania. SSEC is a leading innovator in single wafer wet etch, clean and surface preparation equipment targeting high growth segments in advanced packaging, micro-electro-mechanical systems (MEMS) and compound semiconductor.
Leading semiconductor test equipment supplier Advantest Corporation will showcase its broad product portfolio, including its semiconductor test solutions, nanotechnology products, terahertz systems, CloudTesting™ Services, MEMS Relay technology and Advantest Finance, Inc. services at SEMICON Japan which will be held at the Tokyo Big Sight in Tokyo, Japan, December 3-5, 2014 in booth number 2508 in East hall 2.
Leading MEMS manufacturer, Kionix, Inc., together with its parent company, ROHM Semiconductor, announce the opening of a new software development center in Oulu, Finland to reinforce their sensor software and development resources.
Research and Markets has announced the addition of the "New Detection Principles & Technical Evolution for MEMS & NEMS" report to their offering.
Cascade Microtech, Inc., a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level, today announced the successful completion of its second users' conference held October 9-10, 2014 in Rome, Italy.
SiTime Corporation, a MEMS and analog semiconductor company, today announced the completion of its acquisition by MegaChips Corporation (Tokyo Stock Exchange: 6875), a top 25 fabless semiconductor company based in Japan. This closing follows the announcement on October 28, 2014, that SiTime had entered into a definitive agreement to be acquired by MegaChips for $200 million in cash.
X-FAB MEMS Foundry today announced it received the “MEMS Foundry of the Year” award at the Best in MEMS & Sensors Innovation Awards ceremony, as part of the MEMS Industry Group’s 10th annual MEMS Executive Congress® held in Scottsdale, Arizona last week.
SCHOTT, a global provider of specialty glasses and materials has expanded its product line with HermeS® wafers integrated with hermetically sealed, solid through glass vias (TGV) suitable for MEMS applications.
Congratulations to Jonas Grossenbacher and co-authors who have a paper "On the micrometre precise mould filling fliquid polymer derived ceramic precursor for 300-um-thick high aspect ratio ceramic MEMS" recently published on Ceramics International.
Qualtré, Inc introduced today the QGYR110Hx BAW MEMS gyroscopes, single-axis angular rate (rotational) sensors designed for harsh environments. Based on Qualtré’s patented Bulk Acoustic Wave (BAW) MEMS technology, the new gyros are manufactured using a highly versatile and scalable High Aspect-Ratio Poly and Single-crystalline Silicon (HARPSS™) fabrication process, which allows an unprecedented combination of robustness, performance, and size advantages over conventional MEMS tuning-fork gyroscopes.
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.