GE (NYSE: GE) announced today that it has signed a contract to supply an ultrapure water system to GLOBALFOUNDRIES’ new semiconductor manufacturing facility currently under construction at the Luther Forest Technology Campus in Saratoga County, N.Y.
Toshiba Corporation (TOKYO: 6502) today announced that it has developed a breakthrough technology for a nanowire transistor, a major candidate for a 3D structure transistor for system LSI in the 16nm generation and beyond.
Design Automation Conference 2010 -- Pyxis Technology, Inc., the company innovating software solutions for the physical design and routing of custom integrated circuits (ICs), announced today that its NexusRoute-HPC (high performance custom) router has been selected for use in the TSMC 28nm Analog and Mixed-Signal (AMS) Reference Flow 1.0.
X-FAB Silicon Foundries, a leading analog/mixed-signal foundry and expert in "More than Moore" technologies, announced it will expand its foundry service to include 8 in. (200 mm) MEMS wafer processing. Moving to the larger wafer diameter and monolithic MEMS/CMOS integration allows significant reductions in manufacturing costs.
McBain Systems has announced the first sale of its new DDR300 NIR (near infrared) Inspection System to one of the world’s largest semiconductor chip manufacturers. Installed in a fab in Kulim, Malaysia, the new Defe...
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, today announced that transaction-level modeling (TLM)-driven design and verification, 3D-IC implementation and integrated DFM are among the many cutting-edge Cadence® technologies and flows that have been incorporated into TSMC Reference Flow 11.0.
TECH today announced that Sitaram Arkalgud, director of 3D interconnect program at SEMATECH, will speak to leading technologists and electronics design suppliers attending the 47th Design Automation Conference (DAC) being held at the Anaheim Convention Center in Anaheim, CA, on June 13-18, 2010.
Over 4,000 engineers, scientists and industry professionals from around the world gathered at the Donald E. Stephens Convention Center in Rosemont, IL last week for the Sensors Expo & Conference, the leading event in North America focused exclusively on sensors and sensor-integrated systems.
Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys, Inc (NASDAQ: SNPS) today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.
EdXact, post-layout verification specialist today announced that its netlist reduction software Jivaro™ has been included in TSMC’s Analog/Mixed-Signal (AMS) Reference Flow for 28nm analog and mixed-signal circuit design.
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