Nanoelectronics News

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Arradiance Receives SBIR Grant to Create Large-Area Microchannel Plates

Arradiance Receives SBIR Grant to Create Large-Area Microchannel Plates

Arradiance, Inc. has been awarded a grant under the Department of Energy Small Business Innovation Research (DOE SBIR) program to develop large-area microchannel plates for use as an alternative to traditional photomultipliers.

From Arradiance 8 Jun 2010

Rudolph Enhances Clients’ Wafer Test Performance by Adding New Capability to VX4 Platform

Rudolph Enhances Clients’ Wafer Test Performance by Adding New Capability to VX4 Platform

Rudolph Technologies, Inc., a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced today the availability of direct-dock probe card capability for its PrecisionWoRx® VX4 probe card test and analysis tool.

From Onto Innovation 8 Jun 2010

Fraunhofer POLO Announces Roll-to-Roll Pilot Production of Transparent Barrier Films

Fraunhofer POLO announces roll-to-roll pilot production of transparent barrier films for encapsulation of flexible electronics and solar cells. Researchers from the Fraunhofer Polymer Surfaces Alliance POLO (Fraunhofe...

8 Jun 2010

EUROPRACTICE Offers Boon to Nanotechnology Researchers

The EUROPRACTICE integrated circuit (IC) service has brought the Taiwan Semiconductor Manufacturing Company (TSMC) into its fold, furthering the close collaboration between this prominent semiconductor foundry and the Be...

7 Jun 2010

TSMC Stretches Open Innovation Platform to Focus on Nano-Scale AMS/RF Design

Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today extended its Open Innovation Platform™ with another focus on system-level design, analog/mixed-signal (AMS)/RF design and two-dimensiona...

7 Jun 2010

Qualcomm Announces Investment in Wafer-Based Optical Products Manufacturer

Anteryon, the world leader in wafer-based, miniature optical module production for mobile phone cameras and laser projection, and Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced w...

7 Jun 2010

Researchers to Test Electrochemical Reactions on Nano-Scale Electrodes

Physicists at the Technische Universitaet Muenchen (TUM) are gearing up for experimental tests of findings they arrived at through theoretical considerations: that electrochemical reactions take place more rapidly on iso...

7 Jun 2010

Imec and Holst Centre Develop "Electronic Nose" Sensor Chip

Imec and Holst Centre have developed very sensitive integrated sensing elements for gas detection. The polymer-coated microbridges in high-density arrays can detect ppm-level concentrations of vapors using on-chip integr...

From IMEC 7 Jun 2010

FMA Unveils MB86L10A Transceiver Developed Using 90nm CMOS Technology

Fujitsu Microelectronics America, Inc. (FMA) today introduced the industry's first transceiver that supports 3GPP LTE/WCDMA/EGPRS wireless phones. The Fujitsu MB86L10A transceiver eliminates 3G and LTE TX and RX in...

5 Jun 2010

Optimized Runsets from POLYTEDA Now Available for UMC's 65nm Processes

POLYTEDA Software Corporation, a provider of advanced verification solutions, today announced the completion of a joint qualification program for POLYTEDA's PowerDRC/LVS product for leading global semiconductor found...

5 Jun 2010

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