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Spansion Announces Sampling of 90nm 256Mb MirrorBit SPI Multi-I/O Flash Memory Device

Spansion Inc. today announced it is sampling its 90nm 256 Megabits (Mb) MirrorBit® Multi-I/O Serial Peripheral Interface (SPI) Flash memory device to set-top box, digital TV and industrial design customers and chipset manufacturers.

31 Mar 2010

Infineon Achieved First-Pass Silicon Success of 40nm Baseband Processor Using Galaxy Platform

Synopsys, Inc., a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that the Galaxy™ Implementation Platform has helped Infineon Technologies AG achieve first-pass silicon success of the 40-nanometer (nm) baseband processor for its X-GOLD™ 626 3G wireless analog and digital system-in-package (SIP).

31 Mar 2010

Startup Licenses UWM nanotechnology

A Milwaukee startup company founded by an engineer at the University of Wisconsin-Milwaukee (UWM) has completed a licensing agreement with the UWM Research Foundation for intellectual property that the company will use to develop nanoscale products and devices.

30 Mar 2010

New Flexible Sensor Interface IC for Battery Management Applications

austriamicrosystems (SIX: AMS), a leading designer and manufacturer of high-performance analog ICs, today announced the AS8510, a high precision data acquisition front-end IC for automotive battery current, voltage, temp...

30 Mar 2010

World Biggest Semiconductor Foundry Orders Carl Zeiss Closed Loop Mask Repair and Verification Solution for 32nm Node

The World biggest semiconductor foundry from Taiwan has placed a combined order for the Mask Defect Repair System MeRiT® HR 32 and the Aerial Image Measurement System AIMS™ 32-193i from Carl Zeiss to prepare for the production of next generation high-end photomasks.

From Carl Zeiss Microscopy GmbH 30 Mar 2010

New RTL Synthesis Solution from Synopsys Shortens Design Schedules in 65nm Technologies

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced Design Compiler® 2010, the latest RTL synthesis innovation within the Galaxy...

From Synopsys, Inc. 30 Mar 2010

MEMS Technology to be Featured at 2010 Globalpress Electronics Summit

Globalpress Connection, a global public relations agency for the high-tech industry, is set to hold its 8th annual Globalpress Electronics Summit from April 26 to 29, 2010, at the Chaminade Resort in Santa Cruz, Calif. P...

30 Mar 2010

Applied Materials Launches New Pre-Clean Chamber for Sub-32nm Logic Devices

Applied Materials, Inc. today announced the semiconductor industry’s first integrated low temperature pre-clean for epitaxial (epi) applications which is available on its market-leading Applied Centura® RP Epi system.

From Applied Materials Inc. 30 Mar 2010

Applied Materials Unveils New Wafer Inspection System for 22nm Chips

Applied Materials, Inc. today unveiled its Applied UVision® 4 wafer inspection system, enabling chipmakers to detect yield-limiting defects in the critical patterning layers of 22nm and below logic and memory devices.

From Applied Materials Inc. 30 Mar 2010

World's Smallest Superconductor Less than 1 Nanometer Wide

The Ohio University-led study, published Sunday as an advance online publication in the journal Nature Nanotechnology, provides the first evidence that nanoscale molecular superconducting wires can be fabricated, which could be used for nanoscale electronic devices and energy applications.

29 Mar 2010