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CMOSIS Raises 3 Million Euros in Additional Capital for Corporate Expansion

CMOS image sensor start-up CMOSIS NV has successfully concluded a round of private equity financing from several highly regarded Belgian high-tech investment firms totalling 3 million euros. Lead investor is ING Corporate Investments of Brussels, Belgium, acting as strategic financial partner.

10 Aug 2009

Carbon Nanotubes and Graphene Having Huge Potential in Electrical and Electronic Applications

Carbon nanotubes and graphene exhibit extraordinary electrical properties for organic materials, and have a huge potential in electrical and electronic applications such as sensors, microelectronic and semi-conductor devices, field emission displays (FEDs), nanoelectrodes and energy conversion devices (e.g., fuel cells and batteries).

9 Aug 2009

Researchers Model the Nano World

Modelling the fabrication processes for integrated circuits can slash production development time and costs by up to 40%. But as transistors, already at nano-scales, become ever smaller, researchers are modelling new wor...

9 Aug 2009

Research Holds Promise for Nano-Scaled Electronics

Research by recent UALR Ph.D. graduate Xiaomin "Helen" Tu is the focus of a recent article in Chemical and Engineering News. The article focuses on research she is doing for DuPont Central Research and Developm...

6 Aug 2009

IDT to Move from Fab-lite to Fab-less Model by Transferring Internal Fabrication Processes to TSMC

IDT® (Integrated Device Technology, Inc.) (NASDAQ:IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience and Taiwan Semiconductor Manufacturing Company (TWSE:2330) (NYSE:TSM), today announced they have entered into an agreement to transfer product fabrication processes and related activities currently running in the IDT Hillsboro, Oregon facility to TSMC foundries.

From TSMC Taiwan Semiconductor Manufacturing Company 6 Aug 2009

"Door to the Future" Highlights Postdoctoral Program

Every year, the Materials Science and Engineering Laboratory (MSEL) at the National Institute of Standards and Technology appoints 10 to 15 new postdoctoral research fellowships under a program sponsored by NIST and mana...

From National Institute of Standards and Tech (NIST) 5 Aug 2009

System Specifically Designed for Plasma Etching Dielectric Films Required in Flexible Electronics Fabrication

The FlexTech Alliance, focused on developing the electronic display and the flexible, printed electronics industry supply chain, today announced the award of a contract to Etched in Time, Inc., totaling $324,000.

5 Aug 2009

BeSang Successfully Developed Multi-Layer Stacked 3D Integrated Circuit Technology

BeSang Inc., a leader in the design, development, and delivery of unsurpassed 3-dimensional integrated circuit solutions, has successfully developed a multi-layer stacked three-dimensional (3D) integrated circuit (IC) te...

4 Aug 2009

Researcher Wins Young Faculty Award from DARPA

University of Kentucky electrical and computer engineering researcher J. Todd Hastings has won a two-year, $300,000 Young Faculty Award from the national Defense Advanced Research Projects Agency (DARPA).

4 Aug 2009

Developing Solar Cells Made From Low-Cost Plastics

A research team headed by David Ginger, a University of Washington associate professor of chemistry, has found a way to make images of tiny bubbles and channels, roughly 10,000 times smaller than a human hair, inside plastic solar cells. These bubbles and channels form within the polymers as they are being created in a baking process, called annealing, that is used to improve the materials' performance.

4 Aug 2009