SEMATECH Will Perform Innovative 3D Applications at CNSE's Albany NanoTech with SET's High Accuracy FC300 System

SET, Smart Equipment Technology, a wholly owned subsidiary of Replisaurus Technologies, has received an order for its high accuracy and high force Device Bonder FC300 from SEMATECH, the global consortium of semiconductor manufacturers. The order was booked earlier this year and the delivery of the machine is scheduled for the end of 2009 at SEMATECH's 3D R+D Center at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex in Albany, N.Y.

“Our comprehensive program is aimed at enabling the manufacturability of 3D interconnects, and will benefit from this versatile platform that addresses the broad spectrum of our member companies' bonding requirements,” said Sitaram Arkalgud, SEMATECH's 3D program director.

“As the SEMATECH-CNSE partnership continues to drive innovative solutions for next-generation nanodevice manufacturing, the addition of SET's bonding system will support that effort,” added Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. “At the same time, the enhanced capabilities at CNSE's world-class Albany NanoTech Complex will further enable the leading-edge research and development that is critical to our global corporate partners.”

The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000N) device bonder for wafers diameters up to 300 mm. It can be equipped with an optional built-in chamber for collective reflow in a gas or vacuum environment. The FC300 also features nanoimprinting capabilities.

In the frame of its 3D integration program, SEMATECH will explore three-dimensional technology and design for applications in various domains. The technology research using the FC300 focuses mainly on die-to-wafer bonding applications. Other processes such as die-to-die bonding will be explored in the future.

The system ordered encompasses an ultrasonic bonding head and a high force bonding head equipped with a confinement chamber that reduces oxide on bumps and bonding pads. This configuration is especially interesting for Cu-Cu bonding applicable to 3D-Ics integration.

The FC300 has unrivalled versatility, and is able to perform various applications on the same platform with a quick process head reconfiguration:

  • High Force Bonding Head, adapted to the thermo-compression bonding process.
  • Low Force Bonding Head, for reflow bonding of all sorts of components, including RF + Optoelectronics device assembly.
  • UV-curing Head for adhesive bonding using the UV-NIL process, etc.

“SET is proud of confirming its leadership position within the industry by providing cutting-edge bonding solutions to major players like SEMATECH. By working closely with our customers, SET has raised process development and flexibility of its equipment to the highest level,” said Gilbert Lecarpentier, SET business development manager.

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