Nanoelectronics News

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$225-Million-Dollar Partnership between SUNYIT and UAlbany's College of Nanoscale Science and Engineering

The creation of a high-tech venture between SUNY Institute of Technology at Utica/Rome (SUNYIT) and the University at Albany’s College of Nanoscale Science and Engineering (CNSE), establishing the Computer Chip Hybrid Integration Partnership (CHIP).

From College of Nanoscale Science and Engineering, University at Albany 15 Jul 2009

Magma Announces Availability of Integrated Low-Power IC Implementation Reference Flow for UMC's Advanced 40-nm Process

Magma(r) Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, today announced the availability of an integrated low-power IC implementation reference flow for UMC's (NYSE:UMC) (TSE:2303) advanced...

15 Jul 2009

Three NIST Scientists Wins PECASE Award

Three scientists at the National Institute of Standards and Technology (NIST) have won Presidential Early Career Awards for Scientists and Engineers (PECASE), the nation's highest honor recognizing extraordinary achievements of young professionals at the outset of their independent research careers.

15 Jul 2009

EMC3D Consortium Extends Goals and Program to July 2011

Members of the international EMC3D semiconductor equipment and materials consortium today announced they will extend the life of the joint agreement to July 2011 from an original closing date of October 2009.

15 Jul 2009

New Grants Seek to Power the Future of Global Electronics with Nanoelectronics

Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today teamed with the National Science Foundation (NSF) to announce funding of $2 million in new supplemental grants for nanoelectronics research.

15 Jul 2009

Cabot Epic D100 CMP Receives SI Magazine's "Editors' Choice Best Products" Award For 2009

Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and growing CMP pad supplier to the semiconductor industry, announced today...

From Cabot Corporation 15 Jul 2009

TSMC Announced Collaboration with NetLogic Microsystems

NetLogic Microsystems, Inc. (NASDAQ:NETL), a leader in the design and development of knowledge-based processors and high-speed integrated circuits, and Taiwan Semiconductor Manufacturing Company (TWSE:2330) (NYSE:TSM) (T...

From TSMC Taiwan Semiconductor Manufacturing Company 15 Jul 2009

Complex, Large-Scale Design is Fully Implemented in Five Weeks

Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, announced today that Hitachi has fully implemented a chip design in excess of 50 million gates in just five weeks using the Cadence&reg...

15 Jul 2009

Researchers Develop Thin-film Electroluminescent Device Using Inorganic Oxides

Hiroshi Takashima and coworkers of the Superconducting Devices Group of the Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology (AIST) have developed red electroluminescent (EL) devices using thin-films of chemically stable perovskite oxides.

15 Jul 2009

SAFC Hitech Announces Details of New Materials Roadmap for MOCVD And ALD Processes on Silicon Semiconductor Substrates

SAFC Hitech, a business segment within SAFC , a member of the Sigma-Aldrich Group, today announced details of its new materials roadmap for Metalorganic Chemical Vapor Deposition (MOCVD) and Atomic Layer Deposition (ALD)...

15 Jul 2009