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Project Aimed at Setting up National Production of 90-nm Topology Very Large Scale Integrated Circuits

RUSNANO Supervisory Council approved the Corporation's participation in the project aimed at setting up national production of 90-nm topology very large scale integrated circuits (VLSI). In the range of products manu...

14 Jul 2009

IMEC Extends its EUV Lithography Research Program

IMEC today announced that it is extending its EUV (extreme ultra-violet) lithography research program with a parallel dedicated EUV mask cleaning research program. The program will build on a new collaboration between IM...

From IMEC 14 Jul 2009

IMEC Launches New Program Focusing on Development of GaN Technology

IMEC today announces the launch of a new industrial affiliation program (IIAP) that will focus on the development of GaN technology for both power conversion and solid state lighting applications.

From IMEC 14 Jul 2009

IMEC Establishes New Partnerships with Solar Cell Material and Equipment Suppliers

IMEC today announced that it has established new partnerships with solar cell material and equipment suppliers. These companies, including MEMC Electronic Materials Inc., Leybold Optics Dresden GmbH, Roth + Rau AG, and Mallinckrodt Baker B.V., have concluded joint-development agreements with IMEC in the frame of IMEC's newly launched wafer-based silicon photovoltaics industrial affiliation program (IIAP).

From IMEC 14 Jul 2009

IMEC Achieved Promising Results in the Race to Scale CMOS to 22nm and Below

IMEC has achieved promising results in the race to scale CMOS to 22nm and below. The breakthroughs from its transistor scaling programs include a successful integration of the laser-anneal technique in a high-K/metal-gate first process and a step forward towards fabricating aggressively scaled germanium-pFET transistors.

From IMEC 14 Jul 2009

ESI Bolster its Technology Offerings for 3D IC Packaging and Memory Repair Product Applications

Electro Scientific Industries, Inc. (Nasdaq:ESIO), a leading provider of world-class photonic systems for microengineering, today announced that it has bolstered its technology offerings for both its 3D IC packaging and ...

From Electro Scientific Industries (ESI) 14 Jul 2009

American Nano Silicon Tech Signs Cooperative R+D Agreement with University

American Nano Silicon Technologies, Inc. (OTCBB: ANNO) ("American Nano" or "the Company"), a leading manufacturer and distributor of Micro-Nano Silicon, announced today that the Company has entered in...

14 Jul 2009

SUSS MicroTec and IMEC to Develop Bonding Technology for 3D System Integration

SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of process and test solutions for the semiconductor and related industries, and the Belgian nanoelectronics research center IMEC have entered a joint development program.

From IMEC 14 Jul 2009

Advanced Diamond Technologies Welcomes UNCD Lightning to its Family of Award-Winning Products

Advanced Diamond Technologies, Inc. (ADT) welcomes UNCD® Lightning™, electrically conductive diamond, to its family of award-winning diamond products. Although natural diamond is highly insulating, UNCD Lightni...

14 Jul 2009

Applied Materials Focusing on Strategies and Technologies Needed for Semiconductor Industry to Successfully Navigate Challenging Times

While the current economic environment is imposing severe constraints on the semiconductor equipment industry, the primary driver for increasing profitability for leading-edge chipmakers is still Moore's Law.

From Applied Materials Inc. 14 Jul 2009