Nanoelectronics News

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Modern Manufacturing Methods Inefficient in Use of Materials and Energy

Modern manufacturing methods are spectacularly inefficient in their use of energy and materials, according to a detailed MIT analysis of the energy use of 20 major manufacturing processes. Overall, new manufacturing ...

27 Mar 2009

The Materials Set to Revolutionize the Electronics Industry

Research and Markets has announced the addition of John Wiley and Sons Ltd's new report "Solution Processing of Inorganic Materials" to their offering. The search for electronic materials that can be ch...

27 Mar 2009

Enable IPC Corp to Present "Ultracapacitors for Off Grid Solar Energy Applications" at Energy Summit

Enable IPC Corporation (PINKSHEETS: EIPC) today announced that Kevin Leonard, Chief Technology Officer of Enable's subsidiary SolRayo, will be presenting on the topic "Ultracapacitors for Off Grid Solar Energy A...

26 Mar 2009

Multi-Functional Cluster Tool Provides Flexibility for Highly Demanding Processes in a Multi-User Environment

Surface Technology Systems plc (STS), a leader in plasma process technologies for manufacturing MEMS and advanced semiconductor devices, today announced that they have installed a CPX cluster tool at MiPlaza in Eindhoven...

26 Mar 2009

Smart Stacking Enables Production Solutions for Photonic Circuits and Wafer-Level 3D Integration Applications

The Soitec Group (Euronext Paris), the world's leading supplier of engineered substrates for the microelectronics industry, announced today that Smart Stacking(TM), its circuit stacking technology, is now ready for b...

From The Soitec Group 26 Mar 2009

Cymbet EnerChip and Konarka Power Plastic Combine for ESC SV 2009 Demo

Cymbet Corporation and Konarka Technologies are combining their unique solar energy capture, energy conversion and energy storage technologies to demonstrate advanced solar energy harvesting techniques. These techniques ...

26 Mar 2009

Fairchild Semiconductor Announces CLosure of Two Wafer Fabs

Fairchild Semiconductor (NYSE: FCS), a leading global supplier of high performance products that drive energy efficiency, announced plans to streamline and consolidate wafer manufacturing.

26 Mar 2009

Working at Nanoscale Level, Researchers Create Stable Superhydrophilic Surfaces on a Glass Substrate

Working at the nanoscale level, University of Arkansas engineering researchers have created stable superhydrophilic surfaces on a glass substrate. The surfaces, made of randomly placed and densely distributed micron-size...

26 Mar 2009

Carl Zeiss Introduces its Newly Developed AURIGA CrossBeam (FIB-SEM) Work-Station

Today, Carl Zeiss SMT introduced its newly developed AURIGA CrossBeam® (FIB-SEM) work-station. As one of the pioneers in developing this class of instruments, and with more than 8 years of FIB-SEM experience, the company incorporated a huge number of innovations in the new AURIGA.

From Carl Zeiss Microscopy GmbH 25 Mar 2009

Researchers Have Produced a Strongly Hydrophobic Nanodiamond Material

Vadym Mochalin, Senior Researcher, and Yury Gogotsi, Trustee Chair Professor of Materials Science + Engineering at Drexel University, have produced a strongly hydrophobic nanodiamond material that shows bright blue fluorescence, just as macroscopic diamonds do.

25 Mar 2009