Nanoelectronics News

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Engineers Use 'Nano-Origami' to Fold Nanoscale Materials into Simple 3-D Structures

Folding paper into shapes such as a crane or a butterfly is challenging enough for most people. Now imagine trying to fold something that's about a hundred times thinner than a human hair and then putting it to use as an electronic device.

25 Feb 2009

Report Examines Worldwide Nanotechnology Electric Vehicle Market

Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new report entitled "Worldwide Nanotechnology Electric Vehicle Market Shares Strategies, a...

25 Feb 2009

Material May Help Usher in Next Generation of Microelectronics

When squeezed, electrons increase their ability to move around. In compounds such as semiconductors and electrical insulators, such squeezing can dramatically change the electrical and magnetic properties.

25 Feb 2009

Forum Explores Emerging Lithography Technologies

Without robust and affordable next-generation lithography, the current semiconductor roadmap could change dramatically. For 22nm and beyond, patterning candidates such as EUVL*, nano-imprint, direct write and optical double patterning methods show promise.

25 Feb 2009

Report Foresees Continued Growth in the Zinc Oxide Electronics Market

The report predicts that revenues from the leading ZnO-related electronics applications will reach about $860 million ($US) in 2012, rising to $2.3 billion in 2016.

24 Feb 2009

eBeam Initiative Aims to Increase Design Starts and Reduce Time-to-market in Semiconductor Industry

A group of leading companies throughout the electronics industry today announced the launch of the eBeam Initiative -- a forum dedicated to the education and promotion of an innovative, new design-to-manufacturing approach known as design for e-beam (DFEB).

24 Feb 2009

Synopsys Announces Joint Collaboration with Powerchip and Nikon on 42-nm Flash Memory Optimization

Synopsys, Inc. (NASDAQ:SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced a joint collaboration with Powerchip and Nikon to deploy the Nikon Scanner Signature Files (NSSF...

From Synopsys, Inc. 24 Feb 2009

10 Emerging Technologies with Potential to Shape the Way We Live and Do Business

The editors of Technology Review, MIT's magazine of innovation, have announced their annual list of 10 emerging technologies with the potential to shape the way we live and do business. These revolutionary innovation...

24 Feb 2009

IBM, Applied Materials, and UAlbany NanoCollege to Jointly Develop Process Modeling Technology for Manufacturing 22 nm Chips

IBM (NYSE: IBM), Applied Materials, Inc. (NASDAQ: AMAT) and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany (UAlbany NanoCollege) today announced an agreement to jointly develop proces...

From Applied Materials Inc. 24 Feb 2009

International Alliance Focusing on Developing Cost-Effective TSV Technology for Next Generation Chips and Sensors

The international EMC-3D semiconductor equipment and materials consortium today announced that Applied Materials, Inc. (Nasdaq:AMAT) has joined the organization. As the industry's leading provider of nanomanufacturing technology solutions, Applied offers critical process and integration expertise in the fields of etching, dielectric and metal deposition, chemical-mechanical polishing, metrology, and inspection.

24 Feb 2009