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Report Examines How the MEMS Business is Boosting Thick-SOI Demand

ATMI Launches New Generation of Post-CMP Cleaning Solutions for 22 Nanometer Nodes

System Enables Chip Manufacturers to Shrink Feature Sizes to 32 Nanometers and Beyond

Combining Computational and Wafer Lithography to Improve Semiconductor Manufacturability

Physicists Constructed Micromachines using Same Trick Model Makers use to Get Ships into Bottle

Physicists Constructed Micromachines using Same Trick Model Makers use to Get Ships into Bottle

PANalytical to Launch its New 2830 ZT Wafer Analyzer at SEMICON Japan 2008

PANalytical to Launch its New 2830 ZT Wafer Analyzer at SEMICON Japan 2008

Report Describes the Chemical Mechanical Polishing Equipment and Materials Market

System Addresses Critical Edge and Backside Defectivity Issues in 45 nm and 32 nm Manufacturing

Hightec Systems to Sell and Service Industry-Leading ALD Systems in Japan

SEMI Announces Year-End Forecast for Chip Equipment Industry

SEMI Announces Year-End Forecast for Chip Equipment Industry

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