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Semiconductor Fab Construction Spending to Decline by 41 Percent

According to the World Fab Forecast report, recently released by SEMI, worldwide fab capacity is expected to grow by five percent in 2008 and is currently expected to increase between four and five percent in 2009. F...

1 Dec 2008

Applied Materials Unveils Applied Centura Silvia Etch System for TSV Applications

Applied Materials, Inc. today unveiled its Applied Centura® Silvia™ Etch system, specifically designed to enable high-performance, low-cost, through-silicon via (TSV) applications. In addition to delivering a h...

From Applied Materials Inc. 1 Dec 2008

Applied Materials Leads Major Effort to Enable the Widespread Adoption of Through-Silicon Vias

Applied Materials, Inc. today announced that it is leading a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically stacking integrated circuits (ICs) to...

From Applied Materials Inc. 1 Dec 2008

Researcher Says Self-Powered Nanodevices are Possible

Imagine a self-powering cell phone that never needs to be charged because it converts sound waves produced by the user into the energy it needs to keep running. It's not as far-fetched as it may seem thanks to the re...

1 Dec 2008

Book Covers Wide Range of Topics in Nano-Structure Related Semiconductor Photonics

Research and Markets has announced the addition of the "Semiconductor Photonics: Nano-Structured Materials and Devices" report to their offering. Selected, peer reviewed papers from the International Confer...

1 Dec 2008

Cambridge NanoTech Announces Expansion of Management Team

Cambridge NanoTech, world leader in Atomic Layer Deposition (ALD) science and equipment for research and industry, today announced that it has expanded its leadership team with the promotion of Dr. Ganesh Sundaram to Vic...

1 Dec 2008

Applied Materials Introduces Aera2 for Lithography to Improve Wafer Critical Dimension Uniformity

Applied Materials, Inc. today announced its Applied Aera2(TM) for Lithography system. Using the system's IntenCD(TM) technology in the fab, semiconductor manufacturers can improve wafer critical dimension uniformity (CDU) by more than 20%, increasing device yield and lowering the per-wafer cost of patterning.

From Applied Materials Inc. 30 Nov 2008