Veeco Instruments Inc. announced today that Xiamen Changelight Co., Ltd. (Changelight) has purchased multiple TurboDisc® EPIK™ 700 Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems for faster production and greater yield of high-quality light emitting diodes (LED) for general lighting applications.
In fundamental research, materials science and industries such as semiconductor processing, life-sciences or manufacturing technology, piezo drives are used for the most challenging positioning tasks. The nano precise alignment of these devices – often multi-axis configurations – is a very crucial factor. Despite the progressing automation, it is sometimes still necessary to control positioning components manually. This is e.g. the case for particularly sensitive or complex set-ups, such as used in laboratory operation or for testing purposes.
The chemistry of the new electronics and electrics is key to its future, whether it is invisible, tightly rollable, biodegradable, edible, employing the memristor logic of the human brain or possessing any other previously- impossible capability in a manufactured device. De-risking that material development is vital yet the information on which to base that has been unavailable. No more.
Researchers at the Department of Physics and the Swiss Nanoscience Institute at the University of Basel, along with colleagues from ETH Zurich, have developed an efficient method to transmit signals from nanocomponents. In an innovative layout, they connected a nanocomponent to two electrical conductors. This made the electrical signal to uncouple in a very efficient manner.
Samtec, Inc., an industry-leading supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec, headed by CEA-Leti. Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialize optical communications solutions using silicon photonics technology for addressing data centers and high-performance computing applications.
The rapid evolution of gadgets has brought us an impressive array of "smart" products from phones to tablets, and now watches and glasses. But they still haven't broken free from their rigid form. Now scientists are reporting in the journal ACS Applied Materials & Interfaces a new step toward bendable electronics. They have developed the first light-emitting, transparent and flexible paper out of environmentally friendly materials via a simple, suction-filtration method.
Nanotronics Imaging, developer of the world’s most technologically advanced nanoimaging solutions, today announced that it has completed its acquisition of Franklin Mechanical & Control, Inc. (Franklin MCI), a Hollister, California-based manufacturer of advanced mechanical and optical equipment. Through this acquisition, Nanotronics will incorporate Franklin MCI as a unique manufacturing division known as Nanotronics Automation offering customers a fully integrated suite of hardware prototyping, production services, and solutions.
Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips.
ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation.
Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3).
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