Nanoelectronics News

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Broadcom Introduces Processing Core Enhanced by 20-nm Mixed-Signal Technologies

NTT Electronics (NEL), a leading supplier of coherent Digital Signal Processor (DSP) solutions to system and module manufacturers worldwide, today announced that its second generation Low-Power DSP product, NLD0640 Gen2 LP-DSP, is now generally available for manufacturers, and is shipping thousands of the new LP-DSP Integrated Circuits (IC's) in its first quarter to fifteen manufacturers worldwide for upgrading and/or downsizing their optical module and system. Its confirmed interoperability among multi-source 100G pluggable coherent optics drives the industry into high-port-density 100G Metro deployments.

24 Mar 2015

Cadence and Intel Partner to Deliver 14nm Library Characterization Reference Flow

Cadence Design Systems Inc. and Intel Corporation today announced that the two companies have delivered a 14nm (nanometer) library characterization reference flow for customers of Intel Custom Foundry, continuing their collaboration on enabling digital and custom/analog flows for the Intel 14nm platform.

From Cadence Design Systems 18 Mar 2015

Nano Labs and ET3M Group Enter into JV Agreement

Nano Labs Corp. is pleased to announce today the Company has entered into a Joint Venture Agreement with the ET3M Group (ET3M) to launch a Market Development Program (MDP) to develop, design, manufacture and sell applications of the ET3M Group's technology.

13 Mar 2015

Cadence Innovus Implementation System Helps Spreadtrum Reduce Turnaround Time of Multi-Million-Cell 28nm IP Block

Cadence Design Systems, Inc. today announced that Spreadtrum Communications (Shanghai) Co., Ltd. utilized the new Cadence® Innovus™ Implementation System to dramatically reduce the turnaround time of a multi-million-cell 28-nanometer (nm) intellectual property (IP) block while delivering to its power, performance, and area (PPA) goals. Spreadtrum’s TAT for this IP block was reduced significantly while meeting the original PPA targets compared to its previous solution.

From Cadence Design Systems 13 Mar 2015

DATE 2015: CEA-Leti to Present Newest Version of Leti-UTSOI2 for UTBB-FDSOI Technology

CEA-Leti today announced the newest version of its advanced compact model for UTBB-FDSOI technology is now available in all major SPICE simulators.

From CEA-Leti 12 Mar 2015

Nano-Earthquakes Could Help Control Properties of 2D Materials

The performance of mobile phone cameras and solar cells could be boosted by “nano-earthquakes”, researchers have found.

12 Mar 2015

Innovative Fabrication Technique for Hybrid Nanostructure Supercapacitor Electrode

As a novel energy storage device, supercapacitors have attracted substantial attention in recent years due to their ultra-high charge and discharge rate, excellent stability, long cycle life and very high power density. Imagine charging your cell phone in just a few seconds or fueling up an electric car in but a few minutes, which are both part of the promising future that supercapacitors could offer.

12 Mar 2015

Juniper Networks Improves TAT for 28nm IP Implementation for Networking Applications with Cadence Innovus

Cadence Design Systems, Inc. today announced that Juniper Networks has utilized Cadence® Innovus™ Implementation System to improve turnaround time (TAT) for physical implementation of their most complex 28-nanometer (nm) intellectual property (IP) for networking applications. The networking company was able to achieve throughput of more than 1.8 million cells per day while also improving out-of-the-box design performance by 15 percent.

From Cadence Design Systems 12 Mar 2015

Uniquify Selected by Nufront as DDR IP Provider for 28nm SoC Project

Uniquify, a leading high-performance semiconductor intellectual property (IP) and system-on-chip (SoC) integration and manufacturing services supplier, today announced an agreement with Nufront of Beijing, China, to provide a high-performance DDR subsystem IP solution that supports DDR4, DDR3, LPDDR3 and LPDDR2 protocols.

12 Mar 2015

Freescale® Achieves 7X Turnaround Time Gain on Multiple 28nm Designs with Cadence® Innovus™ Implementation System

Cadence Design Systems, Inc. today announced that Freescale® Semiconductor has achieved a 7X gain in turnaround time with Cadence® Innovus™ Implementation System over its previous production environment while maintaining its quality of results.

From Cadence Design Systems 12 Mar 2015

Nanoelectronics News

Broadcom Introduces Processing Core Enhanced by 20-nm Mixed-Signal Technologies

Cadence and Intel Partner to Deliver 14nm Library Characterization Reference Flow

Nano Labs and ET3M Group Enter into JV Agreement

Cadence Innovus Implementation System Helps Spreadtrum Reduce Turnaround Time of Multi-Million-Cell 28nm IP Block

DATE 2015: CEA-Leti to Present Newest Version of Leti-UTSOI2 for UTBB-FDSOI Technology

Nano-Earthquakes Could Help Control Properties of 2D Materials

Innovative Fabrication Technique for Hybrid Nanostructure Supercapacitor Electrode

Juniper Networks Improves TAT for 28nm IP Implementation for Networking Applications with Cadence Innovus

Uniquify Selected by Nufront as DDR IP Provider for 28nm SoC Project

Freescale® Achieves 7X Turnaround Time Gain on Multiple 28nm Designs with Cadence® Innovus™ Implementation System

New Study Finds Electrons Flow Like Liquid in Graphene, Breaking Rules

Research Boosts Graphene’s Potential to Unprecedented Heights

Novel 3D Imaging Technique Captures In Situ Nanoparticle Self-Assembly

Orange Peel Nanoparticles: New Green Synthesis

Nanoparticles That Boost Tomato Plant Growth

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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