Nanoelectronics News

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ANSYS RedHawk and Totem Products Receive TSMC Certification for 10nm FinFET DRM and SPICE Models

ANSYS, Inc. announced today that its ANSYS® RedHawk™ and ANSYS Totem™ products are certified by TSMC for the most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models, addressing the power and performance requirements for mobile, computing and networking applications.

7 Apr 2015

KaiStar Places Order for Multiple Veeco TurboDisc® EPIK700 GaN MOCVD Systems

Veeco Instruments Inc. announced today that KaiStar Lighting Co., Ltd., based in Xiamen, China has ordered multiple TurboDisc® EPIK700™ Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems.

7 Apr 2015

TSMC 2015 Technology Symposium: Silvaco to Showcase Reliability Solutions from TCAD to Verification

Silvaco to showcase Reliability Solutions from TCAD to Verification, Custom Design Flow and SPICE Modeling Solutions for IoT Applications, Advanced Node-Ready SPICE Simulator at TSMC 2015 Technology Symposium.

3 Apr 2015

TSMC 2015 Technology Symposia: Kilopass to Highlight Antifuse NVM IP

Kilopass Technology, Inc. Will Showcase IP's Ultra Low-Power, Fast Access Speed, Megabits of Capacity, 10 Years of Data Retention, Flexible Programming Options.

3 Apr 2015

Nano-GaN Power Electronic Devices Project Secures €1 Million in Funding

Tyndall National Institute has partnered with US and Northern Irish research institutes to secure €1 million in funding to develop new ways of harnessing converted electricity. The Nano-GaN Power Electronic Devices project has the potential to have a global impact across the entire power electronics industry.

3 Apr 2015

Rudolph Receives Multi-Million Dollar Orders for NSX® Series and Wafer Scanner™ Inspection Systems

Rudolph Technologies, Inc. announced today that a major semiconductor foundry and a top outsourced semiconductor assembly and test (OSAT) facility have placed multi-million dollar orders totaling approximately $17 million for several NSX®Series and Wafer Scanner™ inspection systems.

2 Apr 2015

Sidense 1T-OTP Macros Satisfy All GLOBALFOUNDRIES' Qualifications for 28nm-HPP and -SLP Processes

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that the Company's SHF 1T-OTP macros for GLOBALFOUNDRIES 28nm HPP and SLP processes have met all of GLOBALFOUNDRIES qualification requirements. Applications for Sidense SHF memory IP include code storage, ROM replacement, secure encryption key storage, configuration, fuse replacement, trimming and calibration in networking, mobile computing and communications, IoT, automotive and industrial applications.

30 Mar 2015

Researchers Produce 2D Multilayered Semiconductor Materials Using Silicon Telluride

Brown University researchers have developed a new method of producing new 2D multilayered graphene-like semiconductor materials in different shapes and orientations using silicon.

27 Mar 2015

WSU Researchers Finding Ways to Quickly Design Materials in Conjunction with the Materials Genomics Initiative

The process of trial and error in scientific research is costly and time-consuming. And while scientific innovation and discovery is necessary to find solutions to some of society’s largest challenges — think clean energy, national security, more accessible technologies —the development of new, more efficient materials typically take decades and millions of dollars.

27 Mar 2015

Sensitivity of Isolated Quantum Systems Harnessed to Characterize Electron Motion

The word “defect” doesn’t usually have a good connotation--often indicating failure. But for physicists, one common defect known as a nitrogen-vacancy center (NV center) has applications in both quantum information processing and ultra-sensitive magnetometry, the measurement of exceedingly faint magnetic fields.

27 Mar 2015

Nanoelectronics News

ANSYS RedHawk and Totem Products Receive TSMC Certification for 10nm FinFET DRM and SPICE Models

KaiStar Places Order for Multiple Veeco TurboDisc® EPIK700 GaN MOCVD Systems

TSMC 2015 Technology Symposium: Silvaco to Showcase Reliability Solutions from TCAD to Verification

TSMC 2015 Technology Symposia: Kilopass to Highlight Antifuse NVM IP

Nano-GaN Power Electronic Devices Project Secures €1 Million in Funding

Rudolph Receives Multi-Million Dollar Orders for NSX® Series and Wafer Scanner™ Inspection Systems

Sidense 1T-OTP Macros Satisfy All GLOBALFOUNDRIES' Qualifications for 28nm-HPP and -SLP Processes

Researchers Produce 2D Multilayered Semiconductor Materials Using Silicon Telluride

WSU Researchers Finding Ways to Quickly Design Materials in Conjunction with the Materials Genomics Initiative

Sensitivity of Isolated Quantum Systems Harnessed to Characterize Electron Motion

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