Jan 14 2011
Research and Markets has announced the addition of the "ST L3G4200D MEMS gyro 3-axes Reverse Costing" report to their offering.
Physical Analysis of the Device Step by Step Reconstruction of the Process Flow Cost of Manufacturing and Estimation of Selling Price
New reverse costing report of the 3-Axis MEMS Gyroscope L3G4200D supplied by STMicroelectronics and featured in the Apple iPhone 4.
The L3G4200D is the first 3-axis gyroscope integrated in a consumer smartphone. Based on a single driving mass manufactured using a surface micromachining process, this Tuning Fork MEMS Gyroscope achieves a dimension of 4x4x1.1mm when packaged in its LGA 16-pin package.
The L3G4200D 3-axis MEMS gyroscope is suitable for consumer applications (Gaming, User interfaces, Image stabilization, Health and fitness and GPS navigation) and Industrial applications (Motion detection, User interfaces, Robotics).
This report provides complete teardown of the geomagnetic sensor with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Key Topics Covered:
- Overview/Introduction
- STMicroelectronics Company Profile
- iPhone 4 Teardown
- Physical analysis
- ASIC Dimensions
- ASIC Markings
- ASIC Bond Pads
- ASIC Optical Views
- ASIC Delayering
- ASIC Cross-Section
- MEMS Markings
- MEMS Bond Pads
- MEMS Dimensions
- MEMS Cap Opening
- MEMS Sensor Optical Views
- MEMS Senor SEM Views
- Physical Data Summary
- Manufacturing Process Flow
- ASIC Process Flow
- MEMS Process Overview
- Description of the Wafer Fabrication Units Cost Analysis
- Yields Explanation
- Yields Hypotheses
- Die per wafer & Probe Test
- ASIC Front-End : Hypotheses
- MEMS Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging
- Back-End 1 : Final test & Calibration
- L3G4200D Component Cost (FE + BE 0 + BE 1)
- Estimated Manufacturer Price Analysis
Source: http://www.researchandmarkets.com/