MonolithIC 3D, a company that developed the monolithic 3D IC technology, has launched several 3D IC technologies that deal with various types of semiconductor devices.
These monolithic 3D technologies include gate arrays and FPGA, NAND Flash, DRAM, and RRAM memory types. They can also be utilized to manufacture micro-displays and image sensors. By using these technologies, the company is able to achieve high performance and power enhancements by eliminating the risks and high costs involved in advanced lithography.
The Founder and CEO of MonolithIC 3D, Zvi Or-Bach, stated that the technology launched by MonolithIC 3D has been selected as a finalist at the forthcoming industry show, SemiconWest 2011, for the Best of West Award. The finalists for this award category are chosen by a panel of semiconductor specialists based on factors such as scientific or engineering success, financial and/or societal influence on the industry.
VP of Technology at MonolithIC 3D, Brian Cronquist, stated that the industry is currently implementing double patterning lithography and expressed concern that it might need to use expensive and high-risk technologies such as EUV lithography and quad patterning in future. He added that such costs associated with scaling down have reduced the number of logic wafer fabrication facilities from over 20 at 130nm node to an estimated less than 5 at the 20nm node. He explained that the monolithic 3D technology is an attractive option and will enable previously existing fabs to compete with the advanced ones.
Source: http://www.monolithic3d.com/