Companiesandmarkets.com has released a new report titled “Thin Layer Deposition Equipment: A Global Strategic Business Report”. The report explains the challenges, trends, growth drivers, market barriers, M&A activities and other influencing factors. It covers geographical markets including the US, the UK, Europe, Germany, France, Japan, the Middle-East and the Asia-Pacific.
The global recession had affected the global semiconductor market which is a major end-user segment of thin layer deposition equipment. The growth within the optoelectronics and semiconductors industries and the growing demand from rising economies are fuelling the return to growth of the global thin layer deposition equipment market, according to the report.
The report forecasts that by 2017, the thin layer deposition equipment market would grow to $33 billion. The report splits the market into two major product segments that include chemical vapor deposition (CVD) and physical vapor deposition (PVD) equipment market, and further by usage as industrial/energy, cutting tools, and medical markets. The report also deals with microelectronics, specialty storage and packaging and optics for PVD. The CVD market is forecast to grow at 10% CAGR to 2017.
The report profiles a number of companies including, ASM International N.V., Novellus Systems, Inc., Ionbond AG, Ultramet, Ti-Coating, Inc., RIBER SA, Tecvac Ltd, Edwards Limited and the OEM Group.
Source: http://www.companiesandmarkets.com/