Thermal processing equipment manufactures SPTS Technologies announced that it has shipped its 600th advanced vertical processor (AVP) vertical batch thermal processing system.
The shipment was sent to Cypress Semiconductor, which will use the AVP for its S8 technology platform. This technology platform is used for a range of the company's products such as NVSRAM, CapSense, TrueTouch, PSoC 3 and PSoC 5.
The AVP which is supplied in configurations of dual-boat or single is manufactured at the Thermal Products Division in California. The division currently develops wafer sizes ranging from 100 to 300 mm for the semiconductor, compound semi conductor, MEMS and power management markets. The AVP also helps the low pressure chemical vapour deposition (LPCVD) process to run smoothly for a period of two years by increasing the working time of the system and its productivity. The major processes involved are annealing of wafer from 100°C to 1200°C, stress controlled SiN, thick doped polysilicon and low-temperature SiGe deposition.
According to Shahin Sharifzadeh, EVP of Cypress Semiconductor the company has partnered with SPTS for its Silicon Nitride Oxide Silicon technology. SPTS' experience and commitment in the thermal processing technology has helped Cypress Semiconductor to deliver its products more effectively into the market.
Source: http://www.stps.com