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Teledyne DALSA to Display Innovations in MEMS and MOEMS Fabrication at OFC/NFOEC 2012

Teledyne DALSA Semiconductor will display its advanced high voltage electrostatic actuator ICs as well as its latest developments in MEMS and MOEMS fabrication at OFC/NFOEC 2012, a major event for next-generation optical solutions, to be conducted from March 4 to 8, 2012 at the Los Angeles Convention Center.

Teledyne DALSA high voltage electrostatic actuator IC

With its knowledge in physics and materials science, vast experience and sophisticated fabrication strategies, Teledyne DALSA Semiconductor is capable of rapidly manufacturing MEMS and MOEMS products. The company’s proven portfolio of MEMS and MOEMS process modules on 150 and 200 mm wafers is its true competitive advantage for producing MEMS micro-mirrors and other optical MEMS products.

Teledyne DALSA also provides a comprehensive portfolio product development and production solutions for high-channel count, low-power actuators for small, high density systems. The company extends its proven MEMS and MOEMS capability with the introduction of DH9685AB, a cost-efficient solution for high density systems. The ROHS-complaint product features 96 high-voltage, high-precision channels of up to 240 V inside a 17x17 mm BGA package. It works via a digital 3-wire interface and consumes less than 500 mW of power. It features 24 optional quads of 4 high-voltage channels that can be programmed with 4 low-voltage 16-bit DACs.

Teledyne DALSA’s Design & Product Services Foundry Manager, Rémi Meingan will deliver a presentation on the DH9685AB electrostatic actuator high voltage IC for future-generation low-power, high density optical system necessities utilizing MOEMS on March 6. The company, a pure-play semiconductor wafer foundry, developed several innovative products in specialties, including CCDs, MEMS and high-voltage CMOS.

Source: http://www.teledynedalsa.com

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