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Reverse Costing Analysis Report on InvenSense MPU-9150 MEMS

Research and Markets has announced the addition of the "InvenSense MPU-9150 Motion Processing Unit Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report on the MPU-9150 MEMS from InvenSense.

The MPU-9150 is a motion tracking MEMS that combines a 3D accelerometer, a 3D gyroscope from Invensense and a 3D digital compass from AKM in the same package, a 4x4x1mm LGA package.

The MPU-9150 is targeted for mobile phones, tablets, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

  • Detailed photos
  • Material analysis
  • Cost of Manufacturing
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Key Topics Covered:

  • Overview / Introduction
    • Executive Summary
    • Reverse Costing Methodology
  • Company Profile
  • Physical Analysis
    • Synthesis of the Physical Analysis
    • Physical Analysis methodology
    • Package characteristics & markings
    • Package opening
    • Package Opening: Dies Bonding
    • Package Cross Section
    • Invensense ASIC Marking
    • Invensense ASIC Dimensions
    • Invensense ASIC minimal dimensions
    • Invensense ASIC Cross section
    • Invensense ASIC Process Characteristics
    • Invensense MEMS marking
    • Invensense MEMS Opening
    • Invensense MEMS Sensing Area
    • Invensense MEMS Cap
    • Invensense MEMS Process Characteristics
    • Magnetometer marking
    • Magnetometer Dimensions
    • Magnetometer Cross Section
    • Magnetometer Process Characteristics
  • Manufacturing Process Flow
    • Global view
    • Process Flow Accelerometer ASIC
    • Process Flow MEMS Accelerometer
    • Process Flow Magnetometer
    • Process Flow Packaging
    • Description of the Wafer Fabrication Unit
  • Cost Analysis
    • Synthesis of the cost analysis
    • Methodology
    • Hypothesis
    • Yield Synthesis
    • Invensense ASIC Wafer Cost
    • Invensense ASIC Die Cost Data
    • MEMS Accelerometer Wafer Cost
    • MEMS Accelerometer cost per Steps
    • MEMS Accelerometer Equipment cost
    • MEMS Accelerometer Material cost
    • MEMS Accelerometer Die Cost
    • Magnetometer Wafer Cost
    • Magnetometer cost per Steps
    • Magnetometer Material cost
    • Magnetometer Die Cost
    • Back-End : Package Cost
    • Back-End : Package Cost Per Steps
    • Back-End : Package Material cost
    • Back-End : Final Test
    • MPU9150 Manufacturing Cost
    • Cost Analysis Evolution over yield
  • Estimated Selling Price Analysis
    • Supply Chain Analysis
    • Estimated Selling Price
    • Price Evolution according to the yield



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