Teledyne DALSA Semiconductor, a Teledyne Technologies company and a world-leading pure-play MEMS foundry, today announced the availability of its new MIDIS 200 mm MEMS fabrication platform for motion sensing devices.
The platform is designed to provide high volume, low cost manufacture of accelerometers and gyroscopes or the integration of both into an Inertial Measurement Unit (IMU), addressing the rapidly expanding demand for inertial sensors for consumer (mobile), automotive, and sports/health applications.
“Our MIDIS™ platform is a break-through technology that greatly reduces time to market by using a standardized process, rather than developing each new device from the ground-up, while making no compromises in performance,” said Donald Robert, VP of Marketing at Teledyne DALSA Semiconductor. “Our high performance Through Silicon Via (TSV) and wafer bonding approach provides high vacuum and hermeticity, without the need for expensive getters, in a very compact wafer level package.”
Key Features and Benefits
Low product cost achieved by reduced die size and elimination of getter
Standardized process reduces time to market, cost and development time
High vacuum and hermeticity allows resonator Q factors > 20,000
Efficient wafer level packaging minimizes overall die size
Comprehensive design rules maximize yield and reliability
Sensors fabricated using Teledyne DALSA’s MIDIS platform are already sampled or in production with alpha customers and the platform is now being made available to the general market. For more information, contact [email protected]. To learn more about the MIDIS platform, visit our website at www.teledynedalsa.com/midis.
Webcast: Introducing MIDIS Platform
Interested in learning more about the MIDIS platform? Register for our live webcast, which will take place on June 27, 2013. During the webcast, Luc Ouellet, VP of Technology Development at Teledyne DALSA Semiconductor and Laurent Robin, Technology & Market Analyst for Inertial MEMS Devices & Technology at Yole Développement will explain the finer points of this breakthrough new platform and the exciting possibilities it enables for consumer device designers.