Apr 16 2015
Experience the newest developments in semiconductor test solutions, nanotechnology products and terahertz systems by visiting leading semiconductor test equipment supplier Advantest Corporation's exhibit at SEMICON Southeast Asia. The exposition takes place April 22-24, 2015, at the SPICE Arena in Penang, Malaysia.
Addressing industry challenges and highlighting technology trends
A Silver Sponsor of SEMICON Southeast Asia, Advantest will exhibit in booth 1109 showcasing its broad product portfolio. This includes the EVA100 measurement system, which combines digital and analog testing, and the TS9000 mold thickness analysis system for measuring the thickness of semiconductor packaging. Other highlighted products include industry-leading SoC test platforms T2000 and V93000 and nanotechnology metrology and lithography tools. New memory testers as well as handlers and device interface solutions will also be showcased. In addition, details about CloudTesting™ Service (CTS), the industry's first on-demand testing service alternative to standard test hardware, will be available.
Advantest experts to present papers
Four Advantest speakers are presenting during the following sessions:
Thursday, April 23
- Product & System Test Forum: 09:40-10:05 "Testing IoT Devices - Sensor, MCU, RF Testing," Mr. Fisher Zhang Zhen Yu, Staff Application Engineer
- EXPOArena Stage: 14:00-14:20 "New Innovative Solution for Test, Measurement and Analysis System," Mr. Larry Liow, Director of Sales and Marketing
- Assembly & Packaging Forum: 15:25-15:50 "Non-Destructive IC Packaging Process Control by Terahertz Time-Domain Spectroscopy," Dr. Shang Yang, Senior R&D Application Engineer
Friday, April 24
- Yield Productivity & Failure Analysis Forum: 10:30-10:50 "Novel Three Dimensional (3D) CD-SEM Profile Measurements," Mr. Ryuichi Ogino, Software Engineer
Source: https://www.advantest.com/