More specifically, this research will use the unique capabilities of Mueller Matrix Spectroscopic Ellipsometry and Rigorous Couple Wave Analysis coupled with Ai Diffract™ software from Onto to advance optical scatterometry for measurement of the shape and dimensions of 3D DRAM systems fabricated from silicon/silicon germanium (Si/SiGe) superlattice structures.
“I applaud Dr. Diebold for receiving this grant from Onto, which is a great example of the advanced research undertaken by our boundary-pushing SUNY Poly faculty, as well as the highly relevant workforce preparation that students attending SUNY Poly are able to gain by working closely with faculty,” said SUNY Poly Interim Dean of the College of Nanoscale Science and Engineering (CNSE) Dr. André Melendez.
In addition, the three-year project will support graduate student learning whereby materials and structures used to fabricate 3D DRAM will be characterized by using X-ray and optical methods. This research will emphasize the measurement of test structures to determine feature shape and dimensions, among other properties.
“I am grateful to Onto Innovation for this support and for our partnership to facilitate mass production of next-gen memory chips,” said Professor Diebold. “I also look forward to enabling this student research opportunity which showcases the ways in which SUNY Poly prepares students for the advanced careers that improve the technologies on which we rely.”
Dr. Diebold is co-author of Optical and Electrical Properties of Nanoscale Materials, with Tino Hoffman (UNC), published in January 2022 by Springer Nature. The book provides an overview of the optical and electrical properties of 2D materials including graphene, transition metal dichalcogenides, and topological materials. When possible, the optical properties are related back to the electronic band structure.
In addition to his previous work with SEMATECH, Dr. Diebold had also held a senior-level research position with Allied Signal, now Honeywell. He has more than 90 technical publications, 50 invited presentations, and numerous book chapters.