Posted in | News | 2D Materials

Synergistic Enhancement of Electronic Packaging Materials

In a recent article published in Molecules, researchers evaluated the synergistic effect of Aluminum Nitride (AlN) and Carbon Nanotubes (CNTs) on the properties of Silicon Rubber (SR) composites.

The aim of the study was to enhance the properties of the SR composites by incorporating different ratios of AlN and CNT fillers. The research utilized a thermal curing technique to fabricate AlN/CNT/SR nanocomposites with varying filler ratios.​​​​​​​

????????????????????Study: Synergistic Effect of Aluminum Nitride and Carbon Nanotube-Reinforced Silicon Rubber Nanocomposites. Image Credit: BONDART PHOTOGRAPHY/Shutterstock.com​​​​​​​​​​​​​Study: Synergistic Effect of Aluminum Nitride and Carbon Nanotube-Reinforced Silicon Rubber Nanocomposites. Image Credit: BONDART PHOTOGRAPHY/Shutterstock.com

Background

Developing advanced materials with tailored properties is crucial for meeting the increasing demands of modern electronic packaging applications. Silicone Rubber (SR) composites have gained significant attention due to their flexibility, electrical insulation, and thermal stability, making them ideal for electronic devices.

However, enhancing the mechanical strength, thermal conductivity, and thermal stability of SR composites remains a challenge, especially for applications requiring high-performance materials.

In this context, incorporating fillers such as Aluminum Nitride (AlN) and Carbon Nanotubes (CNTs) into SR matrices has been proposed as a promising strategy to improve the overall properties of the composites.

Understanding the synergistic effects of combining different fillers is essential for developing advanced materials for electronic applications.

The Current Study

The AlN and CNTs used in this study were of high purity and specific dimensions to ensure uniform dispersion within the Silicon Rubber (SR) matrix.

The low-viscosity and high-viscosity components of the SR were measured and mixed according to a predetermined ratio. The AlN and CNT fillers were added to the SR components in varying proportions to create different AlN/CNT/SR nanocomposites.

Fabricating the AlN/CNT/SR composites involved a thermal curing technique. The mixture of SR components and fillers was subjected to controlled temperature and pressure conditions to initiate the curing process.

Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM) were employed to analyze the dispersion and morphology of the AlN and CNT fillers within the SR matrix.

These imaging techniques provided detailed insights into the distribution of fillers, their interaction with the polymer matrix, and the formation of filler networks within the composite.

The mechanical properties of the AlN/CNT/SR nanocomposites were evaluated using standardized testing methods. Tensile strength, elongation at break, and Shore A hardness measurements were conducted to assess the structural integrity and durability of the composites. These tests provided valuable data on the load-bearing capacity and flexibility of the materials.

The thermal conductivity of the AlN/CNT/SR composites was determined using established thermal analysis techniques. The influence of AlN/CNT ratios on the thermal conductivity of the nanocomposites was investigated to understand the synergistic effect of hybrid fillers on heat transfer within the material.

Thermogravimetric Analysis (TGA) was performed to study the thermal decomposition behavior of the AlN/CNT/SR composites.

The temperature-dependent weight loss and residue formation profiles were analyzed to assess the thermal stability of the materials under high-temperature conditions, which is crucial for electronic packaging applications.

Results and Discussion

The mechanical properties of the AlN/CNT/SR nanocomposites were evaluated to assess the impact of filler incorporation on the structural integrity and performance of the materials.

The tensile strength and elongation at the break of the composites were found to be significantly influenced by the presence of AlN and CNT fillers.

The hybrid filler system exhibited a synergistic effect, leading to improvements in both tensile strength and elongation at break compared to pure SR and individual filler systems. This enhancement can be attributed to the reinforcement provided by the AlN particles and the network formation facilitated by the CNTs within the SR matrix.

The thermal conductivity results demonstrated a notable increase in thermal conductivity by incorporating AlN and CNT fillers. The synergistic effect of the hybrid fillers was evident in the enhanced thermal conductivity of the nanocomposites compared to those with individual fillers.

The improved thermal conductivity can be attributed to the efficient heat transfer pathways created by the AlN/CNT hybrid filler network, which facilitated the dispersion and conduction of heat within the composite structure.

The TGA results indicated that the nanocomposites exhibited enhanced thermal stability compared to pure SR, highlighting the hybrid filler system's effectiveness in improving the materials' thermal resistance.

AlN and CNT fillers formed a thermally stable network within the SR matrix, which effectively delayed the thermal decomposition process and increased the material's resistance to heat-induced degradation.

Conclusion

In conclusion, the research demonstrated that the synergistic effect of AlN and CNT fillers in SR composites led to enhanced properties compared to individual filler systems. The comprehensive properties of the AlN/CNT/SR nanocomposites were superior to those of AlN/SR and CNT/SR composites.

The study highlights the potential of utilizing hybrid fillers to improve the performance of polymer composites for electronic applications, emphasizing the importance of filler dispersion and interaction for achieving desired material characteristics.

Journal Reference

Gao J., Xiong H., et al. (2024). Synergistic Effect of Aluminum Nitride and Carbon Nanotube-Reinforced Silicon Rubber Nanocomposites. Molecules, 29, 2864. doi: 10.3390/molecules29122864. https://www.mdpi.com/1420-3049/29/12/2864

Dr. Noopur Jain

Written by

Dr. Noopur Jain

Dr. Noopur Jain is an accomplished Scientific Writer based in the city of New Delhi, India. With a Ph.D. in Materials Science, she brings a depth of knowledge and experience in electron microscopy, catalysis, and soft materials. Her scientific publishing record is a testament to her dedication and expertise in the field. Additionally, she has hands-on experience in the field of chemical formulations, microscopy technique development and statistical analysis.    

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Jain, Noopur. (2024, July 01). Synergistic Enhancement of Electronic Packaging Materials. AZoNano. Retrieved on July 12, 2024 from https://www.azonano.com/news.aspx?newsID=40945.

  • MLA

    Jain, Noopur. "Synergistic Enhancement of Electronic Packaging Materials". AZoNano. 12 July 2024. <https://www.azonano.com/news.aspx?newsID=40945>.

  • Chicago

    Jain, Noopur. "Synergistic Enhancement of Electronic Packaging Materials". AZoNano. https://www.azonano.com/news.aspx?newsID=40945. (accessed July 12, 2024).

  • Harvard

    Jain, Noopur. 2024. Synergistic Enhancement of Electronic Packaging Materials. AZoNano, viewed 12 July 2024, https://www.azonano.com/news.aspx?newsID=40945.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.