Jul 30 2007
Veeco Instruments Inc. announced today that it has received multiple orders for the new NEXUS Atomic Layer Deposition (ALD) System from global thin film magnetic head manufacturers. The next generation NEXUS ALD tool is designed specifically to meet the film requirements of advanced technology Perpendicular Magnetic Recording (PMR) heads. Key benefits include a high deposition rate combined with low stress and excellent conformality, all delivered with excellent cost of ownership.
"The next generation NEXUS ALD System incorporates newly developed technology that enables faster deposition rates than traditional ALD systems, along with proprietary techniques for stress control, to achieve the highest throughput and the lowest stress films in the industry," commented James T. Jenson, Veeco's Vice President and General Manager of PVD/ALD Equipment. "As manufacturers of thin film magnetic heads continue their transition to PMR technology, the NEXUS ALD System is a key enabler for advanced fabrication with a low cost of ownership."
Veeco's NEXUS ALD System deposits advanced dielectric and metal films for data storage applications with superior conformality at faster deposition rates than traditional ALD systems. Designed with high rate capability, Veeco's NEXUS ALD system is ideal for applications such as PMR write pole encapsulation. The system can also be operated in a low temperature mode, optimized for TMR sensor isolation. Each module can be configured to produce a range of films in both development and production modes. As part of Veeco's NEXUS family, it can be integrated on a common hardware and software platform with complementary Veeco technologies, such as ion beam etch, ion beam deposition and physical vapor deposition.