The National Nanotechnology Coordination Office (NNCO) and the Museum of Science Fiction (MOSF) have teamed up for this year's Awesome Con to present two exciting panels, Nanotechnology: Fact from Fiction and 3D Printing: "Replicating" Success. The purpose of these panels is to examine the intersection between science, technology, science fiction, and popular culture, and to discuss ways in which these new technologies will impact our lives.
Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips.
ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation.
Altera Corporation today announced the availability of the latest version of its Industrial Functional Safety Data Package (Ver. 3), for systems designers using Altera field programmable gate arrays (FPGAs). The safety pack provides TUV Rheinland-certified toolflows, IP and devices including Cyclone V FPGAs, enabling faster time for market for industrial safety solutions to IEC 61508 up to Safety Integrity Level 3 (SIL3).
Kyocera America, Inc., Chemical Sales Division, today announced the U.S. introduction of its environmentally-friendly XT2773R7 Silver Sinter Paste, a proprietary formulation specifically developed to deliver a wider range of benefits and performance characteristics compared to high-lead solders.
X-FAB Silicon Foundries and Exagan, a start-up innovator of Gallium Nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, have entered into a joint development agreement to industrialize Exagan’s GaN-on-silicon technology, begin producing high-speed power switching devices on 200mm wafers and establish a European production center where the two partner companies will manufacture GaN devices for the solar, industrial, automotive, IT electronics and other markets.
CAP-XX, developer of flat supercapacitors for burst and back-up power in space-constrained electronic devices, today launched its Thinline series of single-cell supercapacitors. The world's thinnest at 0.6mm thick, and with prices starting at less than US$1 in large volumes, Thinline was developed to address the size, weight and cost challenges of designing thin, sometimes disposable electronic devices for the Internet of Things (IoT).
Researchers at the Department of Energy’s Oak Ridge National Laboratory (ORNL) have developed a new method for commercial-scale fabrication of graphene. This could lead to significant advances in flexible electronics, and could possibly change the manner in which graphene is viewed and utilized.
ARM and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the availability of a new ARM® Artisan® physical IP solution on 55nm to accelerate the development of ARM processor-based embedded systems and Internet of Things (IoT) applications.
BESSTECH Announces $250K Investment from Eastern New York Angels Funding will accelerate commercialization of BESSTECH’s innovative lithium-ion battery electrode technology and enable hiring of key personnel.
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