Ceapro Inc. ("Ceapro" or the "Company"), a growth-stage biotechnology company focused on the development and commercialization of active ingredients for the healthcare and cosmetic industries, announced today it will embark on a scale-up of its proprietary PGX technology to commercial and demonstration levels.
Xilinx, Inc. announced that it has collaborated with TSMC on the 7nm process and 3D IC technology for its next generation of All Programmable FPGAs, MPSoCs, and 3D ICs. The technology represents the fourth consecutive generation where the two companies have worked together on advanced process and CoWoS 3D stacking technology, and will become TSMC's fourth generation of FinFET technology. The collaboration will provide Xilinx a multi-node scaling advantage and build on its outstanding product, execution, and market success at 28nm, 20nm, and 16nm nodes.
Veeco Instruments Inc. announced today that Xiamen Changelight Co., Ltd. (Changelight) has purchased multiple TurboDisc® EPIK™ 700 Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) systems for faster production and greater yield of high-quality light emitting diodes (LED) for general lighting applications.
Researchers at Brookhaven National Laboratory of the U.S. Department of Energy (DOE) have combined the artificial strands of DNA to function in two ways: rope-like configurations of the DNA double helix were used to create a strong geometrical framework, and dangling pieces of single-strands of DNA were added to stick nanoparticles in place.
Unexpected shapes of mesoscale atoms -- structures built of microdroplets encapsulated within microdroplets -- have been created at the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw, Poland. The discovery was possible with a new method for precise control over placement of tiny segments of liquid, one in another. With further progress in innovative microfluidic systems, the method may find use in medicine and materials science.
SEMTech Solutions, in partnership with Elionix, is pleased to announce the delivery of a 100kV Electron Beam Lithography (EBL) system to the City University of New York’s (CUNY) Advanced Science Research Center (ASRC).
As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ leading plasma processing Nanofab® equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.
The National Nanotechnology Coordination Office (NNCO) and the Museum of Science Fiction (MOSF) have teamed up for this year's Awesome Con to present two exciting panels, Nanotechnology: Fact from Fiction and 3D Printing: "Replicating" Success. The purpose of these panels is to examine the intersection between science, technology, science fiction, and popular culture, and to discuss ways in which these new technologies will impact our lives.
Applied Materials, Inc. today announced its Applied Endura® Cirrus(TM) HTX PVD* system with breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask - the industry's material of choice - to meet the patterning needs of copper interconnects in advanced microchips.
ProPlus Design Solutions, Inc. today announced Attopsemi Technology Co., of Hsinchu, Taiwan, developer of state-of-art logic-compatible one-time-programmable (OTP) memory intellectual property (IP), has adopted its high-capacity, high-performance parallel GigaSpice simulator for giga-scale circuit simulation.
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