Nanofabrication News

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Computer Simulations Help Dispel Misconception about Mg-ion Batteries

Lithium (Li)-ion batteries serve us well, powering our laptops, tablets, cell phones and a host of other gadgets and devices. However, for future automotive applications, we will need rechargeable batteries with significant increases in energy density, reductions in cost and improvements in safety. Hence the big push in the battery industry to develop an alternative to the Li-ion technology.

17 Oct 2014

Major Aviation Component Supplier Places $1.7 Million Order with CVD Equipment

CVD Equipment Corporation announced today that it has received a $1.7 million order for additional features to be incorporated into the multi-million dollar order we received earlier this year from a major aviation component supplier.

From CVD Equipment Corporation 17 Oct 2014

Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Professor Douglas Paul received the Institute of Physics President’s Medal at an event in London today (Wednesday 15 October).

17 Oct 2014

Oxford Instruments Plasma Technology and IOP to Hold Webinar on Fabrication Technologies for 2D Materials

One of the key technical challenges when working towards the commercial realisation of graphene and related 2D materials is the development of robust fabrication techniques for deposition, etching and integration with other processes in a device-fabrication facility.

From Oxford Instruments Plasma Technology 16 Oct 2014

Major Advance in Implementation of ETPN Nanomedicine Translation Hub

A major step in implementing the ETPN Translation Hub has been reached, with three European projects entering the finalisation stage of their EU Grant Agreements. The project ENATRANS is for networking of SMEs in the nano-biomedical sector and supporting the SMEs with getting their products from the laboratory phase to the clinical applications.

16 Oct 2014

Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

Tortech Nanofibres, a subsidiary of Plasan, today announces the installation of additional capacity for the manufacture of its nonwoven carbon nanotube (CNT) sheet at its manufacturing facility. This will more than triple output once full commissioning is completed in the next few months and is an important step towards a full scale industrial manufacturing capability.

15 Oct 2014

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

Flip chips are appearing in a plethora of high-volume consumer products such as mobile phones, digital cameras, MP3 players, and computer peripherals. Wafer-level packaging (WLP), the fabrication of the package directly on the wafer, is experiencing exceptional growth and stands out as one of the bright growth areas in electronics today.

14 Oct 2014

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure.

From Cadence Design Systems 10 Oct 2014

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that TSMC is recognizing Synopsys with their "2014 Partner of the Year" award in the areas of: Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure.

From Synopsys, Inc. 9 Oct 2014

New Automated High-Vacuum Wafer Bonding System from EV Group

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®580 ComBond®¯a high-vacuum wafer bonding system, which enables electrically conductive and oxide-free covalent bonds at room temperature.

8 Oct 2014

Nanofabrication News

Computer Simulations Help Dispel Misconception about Mg-ion Batteries

Major Aviation Component Supplier Places $1.7 Million Order with CVD Equipment

Glasgow Nanofabrication Expert Honored with Institute of Physics President’s Medal

Oxford Instruments Plasma Technology and IOP to Hold Webinar on Fabrication Technologies for 2D Materials

Major Advance in Implementation of ETPN Nanomedicine Translation Hub

Tortech Nanofibres Installs Additional Capacity for Manufacture of Nonwoven Carbon Nanotube Sheets

New Report on Lithography, Deposition, and Etch Market Analysis for Flip Chip/WLP Manufacturing

TSMC Honors Cadence with Partner of the Year Awards for Soft IP and 16nm FinFET Plus Solutions

Synopsys Honored with TSMC Partner of the Year Award for Interface IP and Joint Development of 16-nm FinFET Plus Design Infrastructure

New Automated High-Vacuum Wafer Bonding System from EV Group

New Nanomaterial Offers Sustainable Drinking Water Solution

Electron-Phonon Interactions Boost 2D Semiconductor Conductivity

Carbon Nanofibers Boost Strength and Durability of Fiber Composites

Nano-Formulations Boost Plant Growth and Inhibit Nematode Production

New Flexible Material Senses Temperature Without External Power

Enhancing Slurry Stability in Lithium-Ion Batteries with Turbiscan Technology

PiFM and its Role in Nanoscale Chemical Imaging

Conversations on AFM: How AI is Automating Scanning Probe Microscopy

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