Nanobusiness News

RSS

The Trend Towards Miniaturisation Helps MM Live Become One of Europe's Largest Trade Shows

Reflecting on the growing trend toward product miniaturisation across an increasing number of manufacturing sectors, MM LIVE, MEMS LIVE and NANO LIVE have rapidly grown to become one of Europe’s largest annual exhibitions and conferences to focus on micro, precision, nano and MEMS manufacturing technologies.

12 Dec 2011

GLOBALFOUNDRIES Certifies Synopsys’ IC Validator for 65, 40, 28 nm Process Nodes

Synopsys has declared that its physical verification product, IC Validator has been certified by GLOBALFOUNDRIES for 65, 40 and 28 nm physical signoff, with immediate accessibility to layout-versus-schematic and design rule check runsets to customers of GLOBALFOUNDRIES.

From GlobalFoundries 12 Dec 2011

Intel, Micron Announce Launch of 20 nm, 128 GB NAND Device

Micron Technology and Intel have set a new standard in NAND flash technology with the introduction of a first-of-its-kind 20 nm, 128 Gb multilevel-cell (MLC) device developed by their joint-development company, IM Flash Technologies.

From Micron Technology, Inc. 9 Dec 2011

IMS Nanofabrication Signs Equity Funding Deal

IMS Nanofabrication, a provider of nanoscale direct-write and mask lithography imaging systems for semiconductor production, has inked an equity funding deal with contribution from Photronics, Intel Capital and private investor groups for the commercialization of its electron multi-beam mask exposure tool (eMET) for mask writing applications at sub 22 nm.

From IMS Nanofabrication GmbH 9 Dec 2011

Aehr Test Systems Announces Supply of 100th Full-Wafer Contactor

Aehr Test Systems, a provider of semiconductor burn-in and test equipment, has supplied its 100th full-wafer contactor for application in its Fox line of equipment used in wafer level burn-in and wafer sort test applications.

9 Dec 2011

IDTechEx Presents Product Development Award in Printed Electronics to Vorbeck Materials and MeadWestvaco

IDTechEx has presented the Product Development Award in Printed Electronics to MeadWestvaco, a pioneer in packaging, and Vorbeck Materials, a provider of products based on graphene, for MeadWestvaco’s novel anti-theft packaging solution called Natralock with Siren Technology.

From Vorbeck Materials 8 Dec 2011

Vapor Technologies Unveils Pure Black Low Temperature Arc Vapor Deposition Coating

Vapor Technologies, a provider of physical vapor deposition thin-film coating devices, has introduced a first-of-its-kind true black sophisticated low temperature arc vapor deposition (LTAVD) coating.

8 Dec 2011

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Applied Materials has established its presence in defect inspection scanning electron microscope (SEM) technology with the introduction of the first-of-its-kind tool called the Applied SEMVision G5 system that allows chip manufacturers to image and study 20 nm yield-limiting imperfections with no manual interference.

From Applied Materials Inc. 8 Dec 2011

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Samsung Austin Semiconductor has declared that it has completed construction and has ramped up to mass production of S2, its 300 mm automated fab in Austin, Texas, in record time.

8 Dec 2011

USHIO Expands UX4 Series of Full-Field Projection Lithography Tools

USHIO has expanded its modular full-field projection lithography tool line called the UX4 Series with the launch of three new models, the UX4-ECO FFPL 150, the UX4-MEMS FFPL 200 and the UX4-3Di FFPL 300, for producing power devices, MEMS devices and three-dimensional LSI devices, respectively.

7 Dec 2011