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Toppan Photomasks to Invest $20 million in its Joint Venture Facility in Shanghai

Toppan Printing’s subsidiary, Toppan Photomasks has declared plans to invest $20 million to expand the production capacity and technology capabilities of its Shanghai joint venture facility in order to meet the growing demand of the semiconductor industry in China.

From Toppan Photomasks Inc. 19 Nov 2011

Capacity Expansion Completed at STATS ChipPAC Taiwan’s Wafer Bump and WLCSP Plant

STATS ChipPAC has declared the completion of the capacity expansion of its 300-mm wafer level chip scale packaging (WLCSP) and wafer bump facility located in Taiwan.

18 Nov 2011

NSCore’s OTP Non-Volatile Memory Qualifies for TSMC 0.18 µm and 65nm Processes

NSCore, a provider of advanced non-volatile memory (NVM) technologies for system-on-chip (SoC) semiconductors, has declared that its PermSRAM embedded one-time program (OTP) NVM technology has qualified for both TSMC 0.18 µm generic (G) and 65 nm low power (LP) processes adhering to the TSMC9000 standards.

18 Nov 2011

Arrow Electronics Adds SiTime’s Stratum 3-Compliant MEMS Oscillators to its Offering

Arrow Electronics has extended its line of offerings with the introduction of SiTime’s line of advanced Stratum 3 compliant MEMS oscillators called the SiT530x that is developed as a substitute for TCXOs and OCXOs.

18 Nov 2011

Molecular Imprints to Supply Lithography Systems for 450 mm Wafer Production

Molecular Imprints, a pioneer in nanopatterning solutions, has declared that a major integrated circuit manufacturer has awarded an order to construct a first-of-its-kind 450-mm capable lithography system.

18 Nov 2011

Plan Your Trip to Pittcon 2012 Using Their New App

The Pittcon 2012 Marketing Committee is pleased to release its official Conference and Exposition Smartphone App, Pittcon 2012. The app will be available for use on iPhone, iPad, Android smartphones, Android tablets, and all other Web enabled devices with access before, during, and after the Conference.

From Pittcon 17 Nov 2011

SiTime Unveils Industry’s Smallest Silicon MEMS Oscillators

SiTime has unveiled the SiT530x line, a portfolio of silicon MEMS timing solutions that comply with Stratum 3 solutions and substitute TCXOs and OCXOs.

17 Nov 2011

Discussion on Role of Nanotechnology in the 2010s at AAAS Auditorium

A discussion on nanotechnology will be conducted as a section of the 2011 Science & Society: Global Challenges Discussion Series at the American Association for the Advancement of Science (AAAS) Auditorium located at 1200 New York Avenue, NW, Washington, D.C.

From American Chemical Society 17 Nov 2011

New Partnership to Advance Wafer-Level Processing for 3D ICs and MEMS

SVTC Technologies, a company specializing in nanotechnology advancement and commercialization, has announced a partnership with SUSS MicroTec, an equipment supplier for MEMS and sophisticated three-dimensional integrated circuit (IC) integration.

17 Nov 2011

Nanosolar Supplies Thin Film Utility Panels for Solar Projects in France and US

Nanosolar, a pioneer in thin film solar cell printing, has declared that it has in collaboration with EDF Energies Nouvelles (EDF EN) and enXco, EDF EN’s subsidiary in the United States has supplied Nanosolar utility panels to two separate solar power projects having a total capacity of roughly 6 MWp.

From Nanosolar, Inc. 17 Nov 2011