MEMS - NEMS News

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Global MEMS Players Database Lists Product Types and Production Capacity

Research and Markets (http://www.researchandmarkets.com/research/63b817/world_mems_players) has announced the addition of the "World MEMS Players Database 2010" directory to their offering. World MEMS Players Databas...

16 Mar 2010

New MEMS Manufacturing Facility and R+D Center in China

MEMSIC, Inc. (NasdaqGM: MEMS), a leading MEMS sensing solution provider, announced today that the company has completed the construction of its new manufacturing facility and R&D center in Wuxi, China.

From MEMSIC Inc. 16 Mar 2010

Seiko Instruments Succeeded in Developing High Precision Silicon Based MEMS Resonator

Seiko Instruments Inc. (SII) has succeeded in developing a high precision siliconbased MEMS resonator. In addition, SII, in collaboration with the Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), has also succeeded in the development of a new wafer level packaging technology for vacuum sealing MEMS devices.

16 Mar 2010

Webcast on March 17 to Discuss Ways to Integrate Silicon Interposers with TSVs

ALLVIA, the first through-silicon via (TSV) foundry, in conjunction with Semiconductor International magazine, will broadcast a webcast on how to build silicon interposers with embedded capacitors in 3D stacked semiconductors.

11 Mar 2010

Precision Microelectronic Assembly Equipment Provider Exhibits Wire Bonder at IMAPS

Palomar Technologies returns to IMAPS International Conference and Exhibition on Device Packaging to be held March 9th - 10th in Scottsdale, Arizona.

9 Mar 2010

Silicon MEMs Microphones Growing 35% in 2009 Says The Information Network

High-Flying Silicon MEMs microphone installations, which nearly doubled between 2006 and 2008, hit a head wind in 2009, according to the report “Silicon Microphones and Speakers: Technology, Market Analysis, and En...

8 Mar 2010

New Technology Allows Nanoscale MEMS to be Constructed within a CMOS Wafer

Baolab Microsystems has announced a new technology to construct nanoscale MEMS (Micro Electro Mechanical Systems) within the structure of the actual CMOS wafer itself using standard, high volume CMOS lines, which is much easier and quicker with fewer process steps than existing MEMS fabrication techniques that build the MEMS on the surface of the wafer.

8 Mar 2010

MEMS - NEMS News

Global MEMS Players Database Lists Product Types and Production Capacity

New MEMS Manufacturing Facility and R+D Center in China

Seiko Instruments Succeeded in Developing High Precision Silicon Based MEMS Resonator

Webcast on March 17 to Discuss Ways to Integrate Silicon Interposers with TSVs

Precision Microelectronic Assembly Equipment Provider Exhibits Wire Bonder at IMAPS

Silicon MEMs Microphones Growing 35% in 2009 Says The Information Network

New Technology Allows Nanoscale MEMS to be Constructed within a CMOS Wafer

Researchers Develop New Technique for Creating Micromachines

Epson Toyocom Develops Smallest 6-Axis Sensor Featuring 3-Axis QMEMS Quartz Gyro-Sensor

Rite Track Becomes Exclusive Distributor for Expertech Diffusion Furnace Products in Asia

Hybrid Nanoparticles Boost p53 mRNA Delivery in Breast Cancer Models

Sunlight Helps Vincristine Form Drug-Bearing Gold Nanoparticles in Five Minutes

Researchers Link Thicker Aluminum Electrodes to Two-Thirds Lower TLS Density in Josephson Junctions

Porous Silica Boosts On-Chip DNA Synthesis Yield For Data Storage

PI Introduces A-323 Air Bearing Scanner, Built in the USA for High-Throughput Wafer Metrology

How DNA Nanotechnology Is Transforming Protein and Materials Research

How First Graphene is Turning Potential into a Reality

Smarter, Faster Stability Testing: Improving Detergent and Cosmetic Formulation Development

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