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CHAD Industries Completes Shipment of Automated Wafer Handling Workcell to Asymtek

CHAD Industries has announced the completion of multiple shipments of its automated wafer handling workcell called WaferMate300-2 for the S-930 dispensing tool, the latest dispensing platform of Asymtek.

12 Oct 2011

Research and Markets Releases Report on Nanoscale Semiconductor-on-Insulator Materials

Online research website Research and Markets has released a report titled “Nanoscaled Semiconductor-on-Insulator Materials, Sensors and Devices”.

10 Oct 2011

STATS ChipPAC to Use Advanced Fan-out Wafer Technology for Semiconductor Market

US-based STATS ChipPAC, which specialises in providing advanced packaging and semiconductor test services has announced that it will cater to a wide range of the semiconductor markets including media tablets, smartphones and cloud computing-based applications by using its fan-out wafer level packaging (FO-WLP) technology.

10 Oct 2011

ARM Artisan Physical IP Solutions for UMC’s 28nm Process Technology

ARM and semiconductor foundry UMC have signed a long term agreement under which UMC will use the ARM Artisan Physical IP solutions for its 28nm process technology.

10 Oct 2011

Adapteva Releases 28 nm 64 RISC Core Epiphany-IV Microprocessor Chip

The semiconductor technology company located in Lexington, Massachusetts, Adapteva has revealed the 4th generation Epiphany multicore architecture IP in 28 nm chip design.

7 Oct 2011

Rudolph Delivers Wafer Scanner and Macro Defect Inspection Systems to Semiconductor Manufacturer

Rudolph Technologies proclaimed that it has delivered its multiple NSX Macro Defect Inspection Systems, Wafer Scanner 3880 3D Inspection System and Discover Yield Management Software Suite to a major semiconductor manufacturing company for developing sophisticated three-dimensional IC integration using through silicon via (TSV) based processes.

From Onto Innovation 7 Oct 2011

Nanoinformatics 2011 Announce Call for Posters

Nanoinformatics 2011 will bring together informatics experts, nanotechnology researchers, and other stakeholders and potential contributors to advance Nanoinformatics 2020 Roadmap goals. The workshop will set a clear pat...

6 Oct 2011

STPS Completes Shipment of its 600th Advanced Vertical Processor for LPCVD Systems

Thermal processing equipment manufactures SPTS Technologies announced that it has shipped its 600th advanced vertical processor (AVP) vertical batch thermal processing system.

1 Oct 2011

Samsung Announces Development of 30 nm Class Process-Based LPDDR3 DRAM

At the eighth annual Samsung Mobile Solutions Forum conducted at Westin Taipei, Samsung Electronics has proclaimed that it has developed a first-of-a-kind monolithic 4 Gb low power double-data-rate 3 (LPDDR3) memory utilizing 30 nm-class process technology to support three-dimensional graphics, ultra resolution displays and quicker processers in the advanced future-generation mobile devices.

From Samsung Electronics 30 Sep 2011

Asian Foundry Producer to Adopt FSI International’s ORION Single Wafer Cleaning System

FSI International, a provider of surface conditioning equipment for the production of microelectronics, has proclaimed that a major foundry producer in Asia has agreed to adopt an ORION single wafer cleaning system.

30 Sep 2011