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AFOSR Funding for Nanotechnology Research

Dr. Jiwoong Park of Cornell University, who receives funding for basic research from the Air Force Office of Scientific Research (AFOSR), is investigating carbon nanostructures that may some day be used in electronic, thermal, mechanical and sensing devices for the Air Force.

25 Sep 2009

Sandia Receives "Trusted Foundry" Accreditation from DoD

Sandia National Laboratories' silicon fabrication facility in Albuquerque, N.M., has been accredited by the Department of Defense (DoD) to provide "trusted foundry" services for both unclassified and classified integrated circuits. The foundry accreditation represents an increase in scope to Sandia's already-existing accreditation for design services.

From Sandia National Laboratories 24 Sep 2009

Intel Introduces First 45nm-Manufactured Consumer Electronics SoC

Intel Corporation today unveiled the Intel® Atom™ processor CE4100, the newest System-on-Chip (SoC) in a family of media processors designed to bring Internet content and services to digital TVs, DVD players and advanced set-top boxes.

24 Sep 2009

Jordan Valley Semiconductors Announces Delivery of JVX6200 XRR Metrology Tool to HDD Vendor

Jordan Valley Semiconductors Ltd., the market leader in X-ray metrology tools is pleased to announce the delivery of its JVX6200 XRR (X-Ray Reflectometry) metrology tool to a leading-edge HDD (Hard Disk Drive) vendor, us...

24 Sep 2009

At Intel, Moore's Law is Alive and Thriving

Paul Otellini, President and CEO of Intel, the world leader in silicon innovation, develops technologies, products and initiatives to continually advance how people work and livetoday displayed a silicon wafer containing...

22 Sep 2009

Obducat to Take Part in Two Trade Fairs

Obducat continues to display its technology to the electronics- and solar cell industry. This week Obducat will take part in two trade fairs, one of which for solar cell technology and one for the hard disk technology.

From Obducat AB 22 Sep 2009

Recognized ESH Leaders to Discuss Future Visions, Current Concerns at Leading Conference for Manufacturers

The 6th Annual ISMI Symposium on Manufacturing Effectiveness is featuring a panel of environment, safety, and health experts during its annual conference being held at the Hilton Austin Airport on October 19-22, 2009. Th...

22 Sep 2009

Toshiba Announces Series of SSD Modules Using 32nm MLC NAND Flash

Toshiba America Electronic Components, Inc. ( TAEC), a U.S. marketing arm of Toshiba Corporation (TOKYO: 6502) for electronic components, today announced a series of solid state drive (SSD) modules using the latest generation Toshiba 32nm MLC NAND flash, at Intel Developers Forum 2009.

21 Sep 2009

Halocarbon Products Enters into Licensing Agreement with IBM

Halocarbon Products Corporation, a leading worldwide producer of specialty fluorochemicals, has entered into a licensing agreement with IBM to access IBM's industry-leading portfolio of patents related to hexafluoroisopropanol-based photoresists for semiconductor manufacturing.

19 Sep 2009

32-Nanometer SOI Technology Enables Improved Speed, Power Savings and Reliability

IBM (NYSE:IBM) has successfully developed a prototype of the semiconductor industry's smallest, densest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technolog...

18 Sep 2009