Taiwan's Industrial Technology Research Institute (ITRI) and Applied
Materials, Inc. announced today a collaboration to accelerate the development
and commercialization of 3D* chip stacking technology. To enable this important
effort, a full line of processing systems from Applied Materials has been selected
by ITRI for its 3D laboratory in Hsinchu, Taiwan. These state-of-the-art systems
will be used for fabricating through-silicon vias (TSVs), a key technique for
making compact, energy-efficient, high performance CMOS image sensors, and stacked
memory and memory/logic chips for mobile communications devices.
Applied and ITRI intend to work together as members of the Stacked-System and
Application Consortium (Ad-STAC). Formed in 2008, Ad-STAC aims to improve 3D
IC technology by bringing together academic institutions and leading semiconductor
companies to share research, leverage government resources and establish standards.
Using Applied's Etch, PVD, CMP and PECVD* systems, Applied and ITRI will
focus on the integration of via first, via last and via reveal TSV process flows,
enabling Ad-STAC's member companies to more rapidly bring their advanced
3D chip designs to market, greatly reducing development time and initial investment.
“Joining forces with a leading research institution such as ITRI is a
very effective way to advance 3D technology and successfully integrate it into
the manufacturing community,” said Dr. Randhir Thakur, senior vice president
and general manager of Applied's Silicon Systems Group. “ITRI's
selection of Applied's entire TSV suite is a testament to our integrated
3D packaging technology, a capability that is unparalleled in the industry.
By performing customers' early stage development on a proven toolset,
the transition to volume manufacturing can be made as fast and transparent as
“We are pleased to be collaborating with Applied Materials in advancing
3D IC technology. ITRI believes that 3D ICs will be a significant part of semiconductor
development during the next ten years. We plan to drive 3D IC integration and
set up a pilot line in our 3D IC lab,” said Dr. Sheng-fu Horng, deputy
general director of the Electronics and Optoelectronics Research Laboratories
at ITRI. “ITRI provides an open environment for new pilot technologies.
We have therefore selected the latest TSV equipment from Applied Materials so
that we can offer companies from different fields, as well as research institutes,
a unique environment to develop and test new technologies and products.”
Underscoring the significance of this collaboration, there will be a ceremony
attended by top officials from Taiwan's Ministry of Economic Affairs.
The event will be held on October 15th at the Taipei Formosa Regent Hotel and
will also feature a joint press conference with executives from ITRI and Applied