Teradyne, Eagle and Nextest Together for First Time at SEMICON China

Teradyne, Inc. (NYSE: TER) will exhibit the industry's broadest set of System-On-a-Chip (SOC) test products for the first time at the SEMICON China show in Shanghai on March 17-19. Teradyne, along with its Eagle Test and Nextest Business Units, will demonstrate leading test solutions including the UltraFLEX™, the Magnum, the new ETS-88™ and the ETS-200T®/FT.

“We are proud to be participating in SEMICON China for the ninth consecutive year,” said SI Wei, Teradyne’s vice president, Semiconductor Test Field Operations, Greater China Region. ”This year, we are showcasing Eagle Test products alongside the Teradyne and Nextest products. Our product portfolio is now one of the strongest in the semiconductor test industry, spanning the entire range of SOC test needs.”

The UltraFLEX™ test system delivers the power and precision needed for testing advanced microprocessors, PC chipsets and graphics, disk drives, video game devices, System-On-a-Chip (SOC) or System-in-Package (SIP), memory, baseband digital, network and broadband devices.

The Magnum EV is a self-contained, low power, low-cost engineering solution for test program development, debug and device engineering on NAND or NOR Flash devices. Due to the system’s small size, engineers can perform the necessary work in an office environment prior to moving devices to manufacturing for volume-production testing.

Designed for high volume commodity and precision device test applications, the new ETS-88 series provides test solutions for multisite applications and has the capability to use multiple handlers or probers simultaneously.

The ETS-200T/FT (Final Test) is designed for testing discrete devices, particularly for Power MOSFET products running on rotary/turret handlers or other index-parallel type handlers.

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