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Results 41 - 50 of 3021 for Wafers
  • Supplier Profile
    The Microscopy business group at Carl Zeiss is the world's only manufacturer of light, X-ray, electron, and ion microscopes. The company's extensive portfolio enables industrial, research and...
  • Supplier Profile
    Semiconductor Manufacturing International Corporation is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in Mainland China, providing integrated...
  • News - 5 Feb 2009
    Despite a sluggish forecast for the overall high-tech industry in 2009, nanomaterials for solar cells grew 47% in 2008 and is projected to grow another 44% in 2009, according to a report Market...
  • Article - 25 Apr 2018
    Cleaving is a fast and simple method used for preparing samples of semiconductor materials, including silicon. In contrast, sapphire does not cleave well, despite being a single crystal.
  • News - 31 May 2011
    Reportlinker has added a new market research report on Permanent Wafer Bonding to its catalogue. The Yole 2011 report on Technologies and Market Trends for Permanent Bonding would be a major enabler...
  • Article - 29 Oct 2003
    Intel's 90 nanometer technology is currently being moved to high volume for its Pentium and Centrino CPUs. Posted October 28 2003
  • News - 14 Jul 2011
    ReneSola, a company that manufactures solar products for the global market, declared that it has started shipping its Virtus modules and wafers in June. The company’s shipments reached a...
  • News - 2 Jul 2011
    Research and Markets has added the report, "Thin Wafer Manufacturing Equipment & Materials Markets" to its offering. The report explains why thin wafers need extraordinary technologies...
  • News - 17 Jun 2010
    ReportsandReports Announce it Will Carry 2010 Deep Research Report on Global and China Solar Wafer or Ingot Industry Market Research Report in its Store. 2010 Deep Research Report on Global and...
  • News - 18 Jun 2009
    CHAD Industries, a pioneer in the area of wafer and substrate handling for WLP (Wafer Level Packaging) applications, has announced that it will be demonstrating CHAD's thin wafer handling...

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