Research and Markets has added the report, "Thin Wafer Manufacturing Equipment & Materials Markets" to its offering. The report explains why thin wafers need extraordinary technologies and handling processes.
Many consumer applications use very thin semiconductor wafers of the order of 50 m. Many manufacturing difficulties arise when wafer thickness reduces below the range of 500 m to 100 m. Ultra-thin wafers deliver low-stability and are more susceptible to stresses. Indeed, the die is subjected to warping and breaking during grinding and other processing stages. To solve these problems, new processes such as temporary bonding technology can be used to manage such ultra-thin wafers. These processes render support to the wafer during post-thinning operations and backgrinding.
Innovative wafer handling technologies have to be formulated because tapes cannot be utilized for ultra-thin wafers owing to the factors such as adhesion, non-uniformity and intense flexibility. The market for temporary bonding technology will undergo a massive growth. This is the first-of-its kind report to explain the applications, markets, and technologies for manufacturing thin wafer. The report includes details about temporary bonding markets, descriptions, trends, and applications for wafer dicing and thinning. This report also provides data about a market analysis conducted on temporary bonding materials including glue, wax, carrier wafers, and tapes.
The total quantity of wafers that need temporary wafer bonding is estimated to be above 35 M by 2016 including all wafer sizes. Key applications that drive temporary bonding are power devices, advanced packaging applications, LEDs and RF devices.
Source: http://www.researchandmarkets.com/