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EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI®FB XT—its next-generation fusion wafer bonding platform, which combines several performance breakthroughs to move the semiconductor industry closer to the goal of high-volume manufacturing (HVM) of 3D-ICs with through-silicon vias (TSVs).

From EV Group 2 Jul 2014

ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

ZEISS introduces the next generation of photomask qualification system AIMS™ 1x-193i at this year´s European Mask and Lithography Conference (EMLC) in Dresden. ZEISS has experience in aerial imaging technology and AIMS™ for more than 20 years and has become a defacto-industry standard for printability analysis of mask defects.

24 Jun 2014

SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house (OSAT).

From SUSS MicroTec AG 13 Jun 2014

Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

To ensure the survival of Moore's law and the success of the nanoelectronics industry, alternative patterning techniques that offer advantages beyond conventional top-down patterning are aggressively being explored.

6 Jun 2014

D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

D2S®, a supplier of computational design platforms based on eBeam and general purpose graphic processing unit (GPGPU) technologies, today announced that it has acquired all assets of Gauda, Inc., a developer of GPGPU-based computational lithography acceleration technology headquartered in Sunnyvale, Calif.

4 Jun 2014

KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

Today, KLA-Tencor Corporation announced the Teron™ SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

21 May 2014

Noel Technologies Now Offers Services for Nanoimprint Technology

Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps.

16 May 2014

nPoint Inc. Announce Release of Two New Piezo Stages

With a position noise of 0.4nm in X and Y axis and 0.2nm in the Z, both stages provide the accuracy necessary for today’s advanced applications. When paired with the LC.400 series DSP controllers, the system provides closed-loop capability via capacitive sensors.

From Motion Solutions 14 May 2014

Researchers Combine Silk Proteins with Photolithography

When most people think of silk, the idea of a shimmering, silk scarf, or luxurious gown comes to mind.

13 May 2014

Global Semiconductor Dry Etching Equipment to Grow at 2.27% CAGR from 2013 to 2018

Research and Markets have announced the addition of the "Global Semiconductor Dry Etching Market 2014-2018" report to their offering.

From Research and Markets 26 Apr 2014

Nanolithography News

EV Group Unveils GEMINI FB XT Fusion Wafer Bonding Platform

ZEISS Introduces Next Generation of Photomask Qualification System, AIMS 1x-193i

SUSS MicroTec Qualifies DSC300 Gen2 Projection Lithography System for Volume Production

Molecular Self-Assemblies Can be Aligned from Nanometers to Millimeters Without External Stimuli Intervention

D2S Acquires Developer of GPGPU-Based Computational Lithography Acceleration Technology

KLA-Tencor Introduces EUV-compatible Teron SL650 Reticle Inspection System for IC Fabs

Noel Technologies Now Offers Services for Nanoimprint Technology

nPoint Inc. Announce Release of Two New Piezo Stages

Researchers Combine Silk Proteins with Photolithography

Global Semiconductor Dry Etching Equipment to Grow at 2.27% CAGR from 2013 to 2018

New 2D Polymers Bridge the Gap in Electron Mobility for Organic Semiconductors

Engineered 3D Hydrogel Addresses Microplastic Contamination in Water

Custom Nanoparticles That Can Transport Drugs to the Heart

New Approach to Flawless Nanocellular Graphene

Papaya Peel Waste Offers Eco-Friendly Photocatalyst Solution

Applying AI-Driven Solutions to Semiconductor Digital Design

Redux AFM: Expanding Access to Automated Nanoscale Imaging

Project Pursues Ultra Low-Cost, Flexible Perovskite Solar Cells

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Nano-Positioning System Based On Motion Control via Magnetic Levitation

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