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Aehr Test Systems Announces Supply of 100th Full-Wafer Contactor

Aehr Test Systems, a provider of semiconductor burn-in and test equipment, has supplied its 100th full-wafer contactor for application in its Fox line of equipment used in wafer level burn-in and wafer sort test applications.

9 Dec 2011

IDTechEx Presents Product Development Award in Printed Electronics to Vorbeck Materials and MeadWestvaco

IDTechEx has presented the Product Development Award in Printed Electronics to MeadWestvaco, a pioneer in packaging, and Vorbeck Materials, a provider of products based on graphene, for MeadWestvaco’s novel anti-theft packaging solution called Natralock with Siren Technology.

From Vorbeck Materials 8 Dec 2011

Vapor Technologies Unveils Pure Black Low Temperature Arc Vapor Deposition Coating

Vapor Technologies, a provider of physical vapor deposition thin-film coating devices, has introduced a first-of-its-kind true black sophisticated low temperature arc vapor deposition (LTAVD) coating.

8 Dec 2011

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Applied Materials has established its presence in defect inspection scanning electron microscope (SEM) technology with the introduction of the first-of-its-kind tool called the Applied SEMVision G5 system that allows chip manufacturers to image and study 20 nm yield-limiting imperfections with no manual interference.

From Applied Materials Inc. 8 Dec 2011

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

Samsung Austin Semiconductor has declared that it has completed construction and has ramped up to mass production of S2, its 300 mm automated fab in Austin, Texas, in record time.

8 Dec 2011

USHIO Expands UX4 Series of Full-Field Projection Lithography Tools

USHIO has expanded its modular full-field projection lithography tool line called the UX4 Series with the launch of three new models, the UX4-ECO FFPL 150, the UX4-MEMS FFPL 200 and the UX4-3Di FFPL 300, for producing power devices, MEMS devices and three-dimensional LSI devices, respectively.

7 Dec 2011

Nanobusiness News

Aehr Test Systems Announces Supply of 100th Full-Wafer Contactor

IDTechEx Presents Product Development Award in Printed Electronics to Vorbeck Materials and MeadWestvaco

Vapor Technologies Unveils Pure Black Low Temperature Arc Vapor Deposition Coating

Applied Materials Unveils Fully Automatic Defect Inspection SEM for Rapid Chip Production

Samsung’s Wafer Production Facility in Austin Reaches Targeted Capacity in Record Time

USHIO Expands UX4 Series of Full-Field Projection Lithography Tools

Gigaphoton Supplies 1,000th Excimer Laser for Semiconductor Photolithography

NanoFusing, Zyvex Technologies Partner to Produce Custom Carbon Nanotube-Enhanced Products

Comprehensive Report on Global Nanocoatings Market

Cleancoating Licenses XTIO2’s Active-Shield Nanocoating Services

Engineered Nanoparticles Break Heavy-Oil Emulsions In One Hour

DNA Origami Pushes Nanotechnology Toward Smarter Medicine and Electronics

Vistec Showcases Momentum in E-Beam Lithography for Photonics and Advanced Semiconductor Applications at EMLC 2026

Nanoparticle Prime Editing Corrects Metabolic Disease Mutation in Mice

Nature’s Nanotech Warriors Could Clean Up Toxic Metal Pollution

How First Graphene is Turning Potential into a Reality

Smarter, Faster Stability Testing: Improving Detergent and Cosmetic Formulation Development

Combining Flexibility and Automation in FIB-SEM for TEM Lamella Preparation

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