USHIO has expanded its modular full-field projection lithography tool line called the UX4 Series with the launch of three new models, the UX4-ECO FFPL 150, the UX4-MEMS FFPL 200 and the UX4-3Di FFPL 300, for producing power devices, MEMS devices and three-dimensional LSI devices, respectively.
The UX4-ECO FFPL 150, the UX4-MEMS FFPL 200 and the UX4-3Di FFPL 300
The UX4-ECO FFPL 150 is based on the same platform used for the earlier UX4-ECO model for producing power devices. Its mask-compatible module enables compatibility with the MPA masks that are commonly utilized for producing power devices, especially discrete devices. Its superior performance lens having a diameter of 150 mm offers an unprecedented resolution of L/S = 2/2 µm, which improves the output for the full-field projection technique, while upgrading the lithography equipment without modifying the current production process. The model will be available from June 2012.
The UX4-MEMS FFPL 200 is a full-field projection lithography system that offers more combination options of superior performance modules to fulfill the requirements of specific devices or to update the systems themselves. It features a lens module with a depth of focus of up to 500 µm and offers back and topside alignment accuracy of the order of ≤ 0.5 µm. It has 30-stage auto mask changer to address the needs for producing various types of MEMS devices. Its unique wafer transfer module allows the handling of special substrates and warped wafers. It features the DC system or double alignment camera system that facilitates high-precision machining of wafer by offering real-time projection of the two sides of a wafer. The tool is available from December 2011.
The UX4-3Di FFPL 300 is based on the same platform utilized for USHIO’s UX4-3Di FFPL 200. It is mounted with a 300-mm full-field projection lens that facilitates to reduce CoO by up to 50% and obtain high output of 120 numbers of 300-mm wafers per hour. The tool is available from December 2011. It is capable of projecting photoresist films having a thickness of 50-100 µm at a high aspect ratio. It features both IR alignment and backside alignment functions.
Source: http://www.ushio.co.jp