STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging.
Leading semiconductor test equipment supplier Advantest Corporation has entered the high-growth market for testing micro-electromechanical system (MEMS)-based sensors by installing V93000 Smart Scale™ systems at several of Freescale Semiconductor's facilities around the world.
SiTime Corporation, the fastest growing semiconductor company, today introduced the SiT15xx family of 32 kHz MEMS oscillators that replace legacy quartz crystal resonators. This new family is targeted at mobile applications, such as smartphones and tablets, which require small size and low power.
Integrated Device Technology, Inc. (IDT®), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the industry’s first differential MEMS oscillators with 100 femtosecond (fs) typical phase jitter performance and integrated frequency margining capability.
Northrop Grumman Corporation is introducing its new LCR-200 Attitude and Heading Reference System (AHRS), based on micro-electromechanical systems (MEMS) technology, at the Aircraft Electronics Association's International Convention and Trade Show, which takes place in Las Vegas from March 25-28.
STMicroelectronics and CMP (Circuits Multi Projets®) today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
EXFO Inc. announced today that it will be attending OFC/NFOEC 2013, March 17-21, 2013, in Anaheim, California, in order to demonstrate its test solution for deploying, validating and troubleshooting networks up to 100G in the field.
EXFO Inc. announces the launch of the MXS-9100, jointly developed with DiCon and available exclusively from EXFO. DiCon Fiberoptics' MXS-9100 MEMS MxN Matrix Optical Switch is optimized for use with EXFO systems and software control, and allows any M input fibers to connect to any N output fibers in a fully non-blocking manner.
Teledyne DALSA Semiconductor will feature its latest advancements in MEMS/MOEMS fabrication along with its innovative High Voltage electrostatic actuator ICs at OFC/NFOEC 2013, the world’s leading event for advancing optical solutions. Hosted at the Anaheim Convention Center, in Anaheim, CA, USA, the exposition will run from March 19-21, 2013 and Teledyne DALSA will be located at booth 3704.
MEMSIC, Inc., a leading MEMS sensing solution provider, today announced financial results for the fourth quarter ended December 31, 2012.
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