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OFC/NFOEC 2013: Teledyne DALSA to Highlight MEMS/MOEMS Fabrication

Teledyne DALSA Semiconductor will feature its latest advancements in MEMS/MOEMS fabrication along with its innovative High Voltage electrostatic actuator ICs at OFC/NFOEC 2013, the world’s leading event for advancing optical solutions. Hosted at the Anaheim Convention Center, in Anaheim, CA, USA, the exposition will run from March 19-21, 2013 and Teledyne DALSA will be located at booth 3704.

Independent MEMS foundry to showcase MEMS fabrication and high voltage product design and manufacturing solutions at world’s leading event for advancing optical solutions

Teledyne DALSA’s Design and Foundry Showcase at OFC/NFOEC:

Leading Independent Pure-Play MEMS Foundry on 150mm & 200mm Wafers – Teledyne DALSA has extensive experience with advanced fabrication strategies and a profound understanding of the physics and materials science that make rapid new product introductions of MEMS and MOEMS possible. Teledyne DALSA MEMS/MOEMS proven process module portfolio on 150mm and 200mm wafers is recognized as exceptional and represents true competitive advantage for manufacturing of MEMS micro-mirrors and other optical MEMS applications.

High Voltage Electrostatic Actuator Design & Manufacturing – Teledyne DALSA also offers a full suite of product development and manufacturing solutions for low-power, high-channel count actuators for compact, high density systems. Teledyne DALSA announces the DH9685AB extending Teledyne DALSA’s industry leading MEMS and MOEMS capability and provides a cost-effective solution for high density systems. It has 96 High Precision, High Voltage Channels up to 240V in a 17x17 mm BGA Package, ROHS compliant. It operates through a versatile digital 3-wire interface.

Customer Interaction / Business Partnerships – Teledyne DALSA’s technology portfolio, together with excellence in planning, quality assurance, and customer interaction deliver highly productive relationships with both customers and business partners.

Where:
OFC/NFOEC
Anaheim Convention Center
Anaheim, CA
Booth 3704

When: March 19-21, 2013

Media Note: For interview requests, please email [email protected] or visit Booth #3704. For high resolution images of Teledyne DALSA products, please visit our online media kit.

Source: http://teledynedalsa.com/

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