MEMS - NEMS News

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Palomar Microelectronics Experts to Explain Wire Bonding, Wafer Scale Packaging and More

Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 - 20, 2009 in Santa Clara, California.

12 Feb 2009

SUSS MicroTec Wafer Bonders Continue to Capture Major Market Share in Advanced MEMS Manufacturing

MST.factory dortmund, a renowned center of competence for micro and nanotechnology based in Germany, has purchased the CB8 High Performance Wafer Bonder from SUSS MicroTec (FWB:SMH)(GER:SMH), a leading supplier of innova...

From SUSS MicroTec AG 10 Feb 2009

Leading ALD Systems Manufacturer Takes Part in Project Aiming at Increasing Efficiency of Solar Cells

Leading Atomic Layer Deposition (ALD) systems manufacturer Picosun Oy, Finland, takes part in an EU funded research project aiming at dramatically increasing the efficiency of solar cells.

9 Feb 2009

MEMS Switch and Varicaps to Reach US$ 650M by 2012

Research and Markets has announced the addition of the "MEMS Switch and Varicap Market 2009" report to their offering. Struggles in industrial market offset by increasing interest from the cell phone indust...

6 Feb 2009

Nanomaterials for Solar Cells Expect to Grow Another 44% in 2009

Despite a sluggish forecast for the overall high-tech industry in 2009, nanomaterials for solar cells grew 47% in 2008 and is projected to grow another 44% in 2009, according to a report Market Outlook for Nanomaterials ...

5 Feb 2009

Company's Fully Automated Wafer Bonding and Aligner Technology to be Installed at Europe's First-ever 8-inch MEMS Fab

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Sweden-based Silex Microsystems, the world's largest independ...

3 Feb 2009

NEXX Systems Become Member of SEMATECH's 3D Interconnect Program

SEMATECH, a global consortium of chip-makers, and NEXX Systems, Inc., a leading provider of process equipment for advanced wafer-level packaging applications, today announced that NEXX Systems has become a member of SEMATECH's 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.

29 Jan 2009

MEMS - NEMS News

Palomar Microelectronics Experts to Explain Wire Bonding, Wafer Scale Packaging and More

SUSS MicroTec Wafer Bonders Continue to Capture Major Market Share in Advanced MEMS Manufacturing

Leading ALD Systems Manufacturer Takes Part in Project Aiming at Increasing Efficiency of Solar Cells

MEMS Switch and Varicaps to Reach US$ 650M by 2012

Nanomaterials for Solar Cells Expect to Grow Another 44% in 2009

Company's Fully Automated Wafer Bonding and Aligner Technology to be Installed at Europe's First-ever 8-inch MEMS Fab

NEXX Systems Become Member of SEMATECH's 3D Interconnect Program

ADT Receives Contract to Develop Diamond Biosensors for Real-time Detection of E. coli and Pathogens

Industry Veteran Named Vice President and General Manager of NVM Solutions Business Unit

Lab-on-a-Chip Company Opens North American Office

Hybrid Nanoparticles Boost p53 mRNA Delivery in Breast Cancer Models

Sunlight Helps Vincristine Form Drug-Bearing Gold Nanoparticles in Five Minutes

Researchers Link Thicker Aluminum Electrodes to Two-Thirds Lower TLS Density in Josephson Junctions

PI Introduces A-323 Air Bearing Scanner, Built in the USA for High-Throughput Wafer Metrology

Porous Silica Boosts On-Chip DNA Synthesis Yield For Data Storage

How DNA Nanotechnology Is Transforming Protein and Materials Research

How First Graphene is Turning Potential into a Reality

Smarter, Faster Stability Testing: Improving Detergent and Cosmetic Formulation Development

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