Research and Markets, the company offering market research solutions, has added the book titled “Nanoelectronics and Information Technology” to its product offering. The book is authored by Rainer Waser and is published by John Wiley and Sons.
The Molecular Foundry, LBNL, USA & Oxford Instruments Plasma Technology announce their 3rd annual seminar which will once again address the latest research and technologies in plasma etch deposition and growth.
Berkeley Design Automation, the provider of nanometer circuit verification solutions, has announced that Teledyne Technologies’ subsidiary, Teledyne Scientific & Imaging has opted for Berkeley’s Analog FastSPICE (AFS) platform for imaging sensor verification.
Heidelberger Druckmaschinen, BASF SE and TU Darmstadt are happy with the first phase results of the joint research project "Nanostructuring and plastic electronics print platform" (NanoPEP) and are determined that they will go on with their combined work. Participating researchers have been working on functional materials based on nanotechnology and related novel printing techniques for processing of these from the summer of 2009.
Applied Nanotech has unveiled a new micron copper particle-based ink material to directly print electronic circuits at a lower cost for display devices, solar cells, mobile devices, and much more.
A research team at the RIKEN Advanced Science Institute has created a first-of-its-kind transistor that utilizes the electrostatic build-up of electrical charge on a strongly-correlated material’s surface to activate bulk transformation of electronic state.
Polyonics has unveiled a new line of clear and white top coated polyimide flexible substrates called PolyFLEX for use in the printed electronics industry. This family of substrates allows printing with resistive, conductive and semi-conductive inks.
A leader in plasma etch and deposition systems for research and industry, Oxford Instruments has recently received an order for a PlasmaPro® System100 ICP180 etch tool to the Otto-von-Guericke University Magdeburg in Germany, to facilitate its Power Semiconductor and HBLED research programme. The system will run GaN on Si etch processes to enable this research.
Researchers at UK’s National Physical Laboratory (NPL) have devised the first three-dimensional ion microtrap that is scalable to handle many tens of ions serving as quantum bits (qubits).
The semiconductor industry is working on the development of cost-effective technique to etch microscopic features onto microchips. The ultimate solution could be the extreme-ultraviolet (EUV) lithography technique that utilizes very-short-wavelength light to etch features that are four folds finer when compared to existing microchips. However, the industry requires huge investment to overcome the physics, chemistry and engineering challenges.
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