Berkeley Design Automation, the provider of nanometer circuit verification solutions, has announced that Teledyne Technologies’ subsidiary, Teledyne Scientific & Imaging has opted for Berkeley’s Analog FastSPICE (AFS) platform for imaging sensor verification.
Jagmohan Bajaj, President of Teledyne Imaging Sensors stated that the selection of the AFS platform was due to its capability to provide five times to ten times faster nanometer SPICE accuracy in comparison to conventional SPICE along with device noise analysis across the complete spectrum for their image sensor designs.
The AFS platform is capable of delivering up to 5x-10x faster SPICE accurate simulation on a single core and 2x-4x increased performance upon multithreading. Equipped with 20 nm foundry certification, the AFS platform facilitates SPICE accurate simulation of RF, analog, digital and mixed signal nanometer circuits. The platform offers circuit characterization solutions through silicon-accurate analysis of device noise. The performance scales near-linearly with increase in number of cores. Modules that be licensed under the AFS Platform include AFS Transient Noise Analysis, AFS Nano SPICE, AFS circuit simulation, AFS Co-Simulation and AFS RF Analysis. Ravi Subramanian, President and CEO of Berkeley Design Automation expressed delight at Teledyne’s selection of the AFS Platform and stated that the selection is an acknowledgement of Berkeley Design Automation being the preferred partner for companies involved in the design of imaging sensor applications.
Source: http://www.berkeley-da.com/