NEXX Systems, a leading provider of processing equipment for advanced wafer-level packaging applications, today announced the shipment of its 50th Stratus electrochemical deposition system, to be installed at a Taiwanese foundry.
McBain Systems of Simi Valley announced that it will be exhibiting at the Semicon West show in San Francisco later this month.
Robotic cars attracted attention last decade with a 100-mile driverless race across the desert competing for a $1 million prize put up by the U.S. government.
The past few years have given rise to a growing...
Eyelit Inc., a manufacturing software provider for visibility, control, and coordination of manufacturing operations for the aerospace & defense, discrete electronics, semiconductor, and photovoltaic (solar) industries, announced today that CEA-Leti, the French nanoelectronics Research & Development plant, has purchased Eyelit’s manufacturing software suite ¯including Eyelit MES, SPC, Asset Management, Quality Management and SYSTEMA’s Equipment Integration Suite¯ to support semiconductor and MEMS production in its facilities in Grenoble, France.
E Ink® Corporation, the leading developer and marketer of electronic paper display technology, today announced the Q2 release of its next generation display technology, Pearl. With Pearl, E Ink expands the capabilities of reflective displays, bringing electronic paper performance to the next level.
Since its discovery, graphene—an unusual and versatile substance composed of a single-layer crystal lattice of carbon atoms—has caused much excitement in the scientific community.
In its bulk state, magnesium oxide (MgO) is a chalky white, rather unreactive mineral that is best known as an ingredient in antacid medication. But when this compound is formed into nanoscale films, only a few atoms dee...
At Semicon West, Leti will highlight some of its latest research findings and key programs for the semiconductor industry, including maskless lithography, FDSOI and 3D integration. The abstracts below summarize Leti&rsqu...
NEXX Systems – a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat, multi-product order for an Apollo physical vapor deposition system and Stratus electrochemical deposition system to Unisem Advanced Technologies (UAT), a wafer bumping facility in Malaysia.
Berkeley Design Automation, Inc., provider of the Analog FastSPICE™ unified circuit verification platform (AFS Platform), today announced that the Taiwan Semiconductor Manufacturing Company (TSMC) has incorporated the AFS Platform in the Analog Mixed Signal (AMS) Reference Flow 1.0 for device noise analysis.
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