Nanoelectronics News

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CTS Electronic Components Awarded Contract from a Major Industrial Manufacturer

Corning and Soitec Group Announces Agreement on Developing High-Performance Silicon-on-Glass Substrates for Flat Panel Mobile Display Market

ASM Receives Order for Pulsar ALD System from Japanese Logic Device Manufacturers

Companies Scrambling to Find Unconventional Ways to Increase Revenue and Maximize Assets

Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

Research into Graphene Nanoribbons Provides New Reasons for Using it as Interconnects In Future Computer Chips

Improved Modeling Enables Encounter Digital Implementation System to Accelerate Advanced Node Design

Strasbaugh Receives Order for nFinity Prime Wafer Polishers

Virage Logic Extends Advanced IP Technology Leadership to the 32/28-Nanometer Process Node

First-Time Tegal Customer Orders Third-Generation ICP Source for 200mm DRIE Applications

First-Time Tegal Customer Orders Third-Generation ICP Source for 200mm DRIE Applications

Third-Generation ICP Source Improves DRIE Productivity and Yield for MEMs And 3d IC Market Applications

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